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Photosensitive resin composition and preparation method thereof

A technology of photosensitive resin and composition, which is applied in the direction of optomechanical equipment, photosensitive materials for optomechanical equipment, optics, etc., and can solve the problems of adhesion and solubility limitations, quality reduction and stability reduction in the development process, etc. Achieve low peeling difficulty, reduce development residue, and improve stability

Active Publication Date: 2019-03-19
湖南五江高科技材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, photosensitive dry film also has some problems
In terms of product performance, conventional dry film resists are limited in terms of adhesion and solubility to the substrate, which will lead to reduced storage stability while satisfying the viscosity; in addition, for most dry films, It is easy to cause development residue during use; from an operational point of view, if there is no relevant work experience when attaching the film, it is easy to cause more air bubbles when attaching the film, resulting in a decrease in the quality of the development process

Method used

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  • Photosensitive resin composition and preparation method thereof
  • Photosensitive resin composition and preparation method thereof
  • Photosensitive resin composition and preparation method thereof

Examples

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preparation example Construction

[0049] In a specific embodiment, the preparation method of the photosensitive resin composition comprises the following steps:

[0050] S1: Preparation of epoxy acrylate prepolymer

[0051] Weigh E-44 epoxy resin and acrylic acid at a weight ratio of 1:2, add 3-4% of onium salt of the total mass of the system as a catalyst, heat in a water bath, raise the temperature to 60-70°C, and stir for 3-5 hours to prepare a ring Oxyacrylate prepolymer;

[0052] S2: Preparation of modified styrene-acrylate copolymer

[0053] Weigh the reaction monomer according to the formula amount, stir it evenly and add it into the reaction kettle, add 2-3% of the total weight of the monomer azobisisoheptanonitrile initiator, keep the temperature of the water bath at 20-40°C, stir for 30-50min, Raise the temperature to 70-110°C and continue stirring for 3-5h to obtain a styrene-acrylate copolymer;

[0054] Add 2% toluenesulfonic acid of the total amount of monomers, then add 3.5-5 parts of (3S)-2,3...

Embodiment 1

[0073] The first aspect of Example 1 provides a photosensitive resin composition, comprising the following components in parts by weight: 21.5 parts of epoxy acrylate prepolymer, 56 parts of modified styrene-acrylate copolymer, alkali-soluble 18.9 parts of resin, 1.5 parts of photoinitiator and 1.2 parts of dye.

[0074] The modified styrene-acrylate copolymer is obtained by (3S)-2,3-dihydro-6-hydroxyl-3-benzofuran acetate modified styrene-acrylate copolymer; the styrene - The reaction monomer of the acrylate copolymer is styrene, methyl methacrylate, ethyl acrylate, and methacrylic acid is combined in a weight ratio of 1:3:4:3; the alkali-soluble resin is polyethylene glycol diacrylic acid 16 parts of esters, 0.3 parts of pentaerythritol triacrylate, 0.5 parts of 1,6-hexanediol diacrylate, 0.3 parts of 2-phenoxyethyl acrylate and 1.8 parts of triethylene glycol dimethacrylate; The photoinitiator is (3R,4R)-3-ethyl-4-[(E)-2-phenylvinyl]-2-azetidinone; the dye is 2-methylanthr...

Embodiment 2

[0086] The first aspect of Example 2 provides a photosensitive resin composition, comprising the following components in parts by weight: 20 parts of epoxy acrylate prepolymer, 50 parts of modified styrene-acrylate copolymer, alkali-soluble 13.5 parts of resin, 0.6 parts of photoinitiator and 1 part of dye.

[0087] The modified styrene-acrylate copolymer is obtained from (3S)-2,3-dihydro-6-hydroxyl-3-benzofuran acetate modified styrene-acrylate copolymer; the styrene - The reaction monomer of the acrylate copolymer is styrene, methyl methacrylate, ethyl acrylate, and methacrylic acid is combined according to a weight ratio of 1:3:4:3; the alkali-soluble resin is polyethylene glycol diacrylic acid 12 parts of ester, 0.1 part of pentaerythritol triacrylate, 0.1 part of 1,6-hexanediol diacrylate, 0.1 part of 2-phenoxyethyl acrylate and 1.2 parts of triethylene glycol dimethacrylate; The photoinitiator is (3R,4R)-3-ethyl-4-[(E)-2-phenylvinyl]-2-azetidinone; the dye is 2-methylan...

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Abstract

The invention provides a photosensitive resin composition. The composition is prepared from the following components in parts by weight: 20-25 parts of epoxy acrylate prepolymer, 50-60 parts of modified styrene-acrylate copolymer, 13.5-24.5 parts of alkali-soluble resin, 0.6-2.5 parts of photo-initiator and 1-1.5 parts of dye.

Description

technical field [0001] The invention relates to a multilayer photosensitive composition, more specifically a photosensitive resin composition and a preparation method thereof. Background technique [0002] The photosensitive dry film is composed of three layers, which are support film layer, resist layer and protective film layer. Among them, the main function of the supporting film layer and the protective film layer is to support and protect the resist layer located in the middle. The dry film is a polymer compound, which can produce a polymerization reaction (the reaction process of synthesizing a polymer from a monomer) after being irradiated by ultraviolet rays to form a stable substance attached to the board surface, so as to prevent electroplating and etching function. [0003] In recent years, with the high integration of electronic equipment, the demand for photosensitive dry film resist has been increasing, and photosensitive dry film resist has become an importa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027
CPCG03F7/004G03F7/027
Inventor 肖志义
Owner 湖南五江高科技材料有限公司
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