Anti-cracking computer heat conduction silicone grease and preparation method thereof
A heat-conducting silicone grease and computer technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve problems affecting the overall performance and service life of the computer, high-temperature working conditions, troublesome hands-on ability, etc., to achieve good performance and improve heat conduction The effect of performance and easy maintenance
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Embodiment 1
[0021] An anti-cracking computer heat-conducting silicone grease, including the following raw materials in parts by weight: 30 parts of methyl silicone oil, 2 parts of vinyltrimethoxysilane, 3 parts of octylphenol polyoxyethylene ether, 6 parts of aluminum oxide, zinc oxide 4 parts, 3 parts of graphene, 4 parts of nano-silver, 5 parts of diamond powder, 1 part of ethylene glycol distearate, 2 parts of coupling agent, 2 parts of di(hydrogenated tallow) phthalic acid amide, 1 part of disodium diamine tetraacetate, 30 parts of absolute ethanol.
[0022] Wherein, the coupling agent is silane coupling agent KH560.
[0023] Wherein, the particle size of the diamond micropowder is not greater than 5 μm.
[0024] In this embodiment, the preparation method of the anti-cracking computer thermal grease, the steps are as follows:
[0025] 1) Mix vinyltrimethoxysilane, octylphenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, coupling agent, and...
Embodiment 2
[0030] A kind of anti-cracking computer heat-conducting silicone grease, including the following raw materials in parts by weight: 35 parts of methyl silicone oil, 3 parts of vinyltrimethoxysilane, 4 parts of octylphenol polyoxyethylene ether, 8 parts of aluminum oxide, zinc oxide 5 parts, 4 parts of graphene, 5 parts of nano-silver, 6 parts of diamond powder, 1.8 parts of ethylene glycol distearate, 4 parts of coupling agent, 5 parts of di(hydrogenated tallow) phthalic acid amide, 1.8 parts of disodium diamine tetraacetate, 45 parts of absolute ethanol.
[0031] Wherein, the coupling agent is silane coupling agent KH560.
[0032] Wherein, the particle size of the diamond micropowder is not greater than 5 μm.
[0033] In this embodiment, the preparation method of the anti-cracking computer thermal grease, the steps are as follows:
[0034] 1) Mix vinyltrimethoxysilane, octylphenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, coupli...
Embodiment 3
[0039] An anti-cracking computer heat-conducting silicone grease, comprising the following raw materials in parts by weight: 40 parts of methyl silicone oil, 4 parts of vinyltrimethoxysilane, 5 parts of octylphenol polyoxyethylene ether, 9 parts of aluminum oxide, zinc oxide 6 parts, 4.5 parts of graphene, 6 parts of nano-silver, 7 parts of diamond powder, 1.5 parts of ethylene glycol distearate, 3.5 parts of coupling agent, 3.5 parts of di(hydrogenated tallow base) phthalic acid amide, 1.5 parts of disodium diamine tetraacetate, 40 parts of absolute ethanol.
[0040] Wherein, the coupling agent is silane coupling agent KH560.
[0041] Wherein, the particle size of the diamond micropowder is not greater than 5 μm.
[0042] In this embodiment, the preparation method of the anti-cracking computer thermal grease, the steps are as follows:
[0043] 1) Mix vinyltrimethoxysilane, octylphenol polyoxyethylene ether, aluminum oxide, zinc oxide, graphene, ethylene glycol distearate, c...
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