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Ultrasonic impact surface modification auxiliary titanium alloy diffusion connection method

A technology of ultrasonic impact and diffusion connection, applied in the field of diffusion connection, can solve the problems of complex process, poor applicability, complicated operation, etc., and achieve the effect of simple structure, convenient operation, and accelerated diffusion efficiency.

Active Publication Date: 2019-03-05
TIANJIN UNIV
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  • Abstract
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AI Technical Summary

Problems solved by technology

The commonly used surface modification methods include high-energy shot peening, mechanical grinding, laser cladding, etc., but the operation is cumbersome, the process is complicated, the applicability is poor, and the cost is high, and the practical application is limited to a certain extent.

Method used

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  • Ultrasonic impact surface modification auxiliary titanium alloy diffusion connection method
  • Ultrasonic impact surface modification auxiliary titanium alloy diffusion connection method
  • Ultrasonic impact surface modification auxiliary titanium alloy diffusion connection method

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Embodiment Construction

[0025] The technical solutions of the present invention will be further described below in conjunction with specific embodiments.

[0026] use attached figure 1 The ultrasonic impact equipment shown is for ultrasonic impact of titanium alloy. It is preferable to use a spherical impact head or a needle-shaped impact head with the same material as the titanium alloy. The ultrasonic impact equipment is selected as the full-wavelength type. Equipment to realize the movement and control of the ultrasonic impact head in three dimensions. as attached figure 2 As shown in Fig. 1, the titanium alloy surface after ultrasonic shock was bonded for diffusion bonding.

[0027] In this example, the ultrasonic shock frequency of TC4 plate is 17.7kHz, the current is set to 3A, the amplitude is 40μm, the diameter of the ultrasonic shock needle is 4mm, the walking speed is 1mm / s, and the number of shocks is 1 pass. for surface modification. Then process the plate into small pieces of 5mm×5m...

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Abstract

The invention discloses an ultrasonic impact surface modification auxiliary titanium alloy diffusion connection method. According to the method, ultrasonic impact is conducted on the surface of a titanium alloy plate, the titanium alloy plate is heated and diffused, so that joints can be tightly combined, and the high-strength connection of a titanium alloy is realized. According to the method, agrain refinement layer is obtained through ultrasonic impact surface modification, the atomic diffusion rate is increased, diffusion connection parameters of the titanium alloy are reduced, and low-temperature diffusion connection of the titanium alloy is realized; and the method is simple and convenient to operate, good in adaptability, high in repeatability, green and energy-saving, and can greatly improve the industrial production efficiency.

Description

technical field [0001] The invention relates to a diffusion bonding technology, more specifically, by ultrasonically impacting the diffusion bonding surface of a metal substrate, a grain refinement layer is formed in a certain depth region of the metal surface, so as to reduce the diffusion bonding temperature and improve the diffusion bonding performance Methods. Background technique [0002] Titanium alloy is a metal structural material with high strength, low elastic modulus, high specific strength and good wear resistance, which is widely used in aerospace, automobile manufacturing, biomedicine and other advanced fields. However, the preparation of some complex and large titanium alloy components involves joining technology, and complex, precise, and strong welded joints with the base metal can be obtained through diffusion joining, which is suitable for various applications. [0003] The microstructure and properties of titanium alloy joints are highly sensitive to dif...

Claims

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Application Information

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IPC IPC(8): C22F3/02
CPCC22F3/02
Inventor 杨振文金靖又刘齐王春雷王颖王东坡
Owner TIANJIN UNIV
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