Preparation process for carbon film tin-sprayed printed circuit board

Abstract

The invention discloses a preparation process for a carbon film tin-sprayed printed circuit board. The process comprises the following steps of performing pretreatment: before resistance welding and carbon film printing, carrying out mechanical polishing brushing and cleaning on a copper plate matrix by using a mechanical polishing, brushing, coarsening and cleaning machine; preparing a printed screen plate: coating a 220-mesh acrylic fiber screen plate with a blocking adhesive with the thickness of 30 [mu]m; performing printing and resistance welding: printing the printed screen plate with printing ink; printing the copper plate matrix with the printed screen plate with the printing ink; and after the copper plate matrix is printed, performing resistance welding on characters; performingsolidifying and baking: adding the copper plate matrix into a seven-temperature-zone internal circulation hot air solidifying machine for performing solidifying; and performing tin spraying: performing the tin spraying on a copper plate substrate, and then performing cooling. The carbon film tin-sprayed printed circuit board prepared with the process is short in production period; high pollution of electroless gold plating is avoided; the difficulty that the copper surface of a common carbon film board is easy to oxidize is overcome; and the overall performance and reliability of the carbon film tin-sprayed printed circuit board are improved.

Description

technical field [0001] The invention relates to a preparation process of a carbon film spray tin printed circuit board. Background technique [0002] At present, the remote control of household appliances and the control panel of washing machine all use ordinary carbon film boards. The copper surface of such carbon film boards is easily oxidized by moisture, which eventually leads to defective products; while high-end products generally use chemical gold boards, which are expensive. The main raw material used in chemical gold is potassium aurous cyanide, which is a highly toxic substance, which has great potential safety hazards in storage, and the wastewater generated during production seriously pollutes the environment, which does not conform to the development trend of green production generations. The tin-spraying of carbon film board can solve the problem that the copper surface of ordinary carbon film board is easy to oxidize, and also avoid the high pollution of chemi...

AI Technical Summary

Problems solved by technology

[0004] 1. Before solder mask and carbon film printing, most manufacturers generally use paulownia boards for production without increasing the roughness of the copper surface, which is not conducive to the bonding force between the carbon film and the copper surface during subsequent carbon film printing. And currently there is no special equipment for adjusting and increasing the roughness of the copper surface;

[0005] 2. The current carbon film plate needs to be cured after the tin spraying process, but there is currently no special curing machine for carbon film plate tin spraying. Now the common multi-stage curing machine on the market will easily produce The temperature difference, that is, the temperature at the exit and entrance of the drying tunnel is low, and the temperature at the center of the drying tunnel is high. This temperature difference can often reach more than 20°C, which is not conducive to the final curing effect of the carbon film plate.

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