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Preparation method of bi-component epoxy resin adhesive

A technology of epoxy resin glue and epoxy resin, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., and can solve problems such as difficult for users to use normally, environmental pollution, high viscosity, etc.

Inactive Publication Date: 2019-02-22
深圳市劲华电子材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Bisphenol A epoxy resin in the current technology exists in liquid form at room temperature, but its viscosity is too high when used alone, it is difficult for users to use normally, so a part of low molecular weight solvent will be added to mix it, Thereby reducing the overall viscosity to achieve sufficient handling convenience
[0003] However, this method will increase the odor of the bisphenol A epoxy resin and increase the shrinkage of the cured epoxy resin because the low molecular weight solvent will volatilize in the bisphenol A epoxy resin, resulting in the use of physical discomfort and environmental pollution

Method used

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  • Preparation method of bi-component epoxy resin adhesive
  • Preparation method of bi-component epoxy resin adhesive
  • Preparation method of bi-component epoxy resin adhesive

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Embodiment Construction

[0018] The manufacturing method of the two-component epoxy resin glue of the present invention is divided into A glue and B glue: A glue adopts the single-epoxy propylene oxide benzyl ether as an auxiliary agent and adds it into the two-component epoxy resin according to the ratio on the formula. Among the phenol A type epoxy resins, the use viscosity of the low molecular weight epoxy resin in supercooled state at room temperature is further reduced, so that while improving the convenience of operation, the odor of solvent-free epoxy will not be lost, and it will be free. Pollution, low shrinkage and other advantages. Moreover, it can also increase the operation time of epoxy resin AB glue after mixing, thereby improving the defoaming property of the glue, reducing the amount of additives used, and improving the overall permeability of the cured product; Phorone diamine reacts with bisphenol A epoxy resin to obtain an amine adduct containing residual amino active hydrogen with...

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Abstract

The invention discloses a preparation method of a bi-component epoxy resin adhesive. The bi-component epoxy resin adhesive is prepared from an adhesive A and an adhesive B, wherein the adhesive A is prepared from 89 parts of epoxy resin, 10 parts of a diluent and 1 part of an assistant, the adhesive B is prepared through the steps that 1, a semi-finished product curing agent is firstly produced and contains 16 parts of epoxy resin, 42 parts of a diluent and 42 parts of isophorone diamine; wherein 2, 71.5 parts of semi-finished product curing agent, 8.5 parts of epoxy resin, 10 parts of diluentand 10 parts of amine-terminated polyether are adopted, wherein the bi-component epoxy resin adhesive is prepared according to the ratio 1 to 1 of the adhesive A to the adhesive B.

Description

technical field [0001] The present invention relates to a manufacturing method of epoxy resin glue, more specifically, the present invention relates to a manufacturing method of two-component epoxy resin glue. Background technique [0002] Bisphenol A epoxy resin in the current technology exists in liquid form at room temperature, but its viscosity is too high when used alone, it is difficult for users to use normally, so a part of low molecular weight solvent will be added to mix it, Thereby reducing the overall viscosity to achieve sufficient handling convenience. [0003] However, this method will increase the odor of the bisphenol A epoxy resin and increase the shrinkage of the cured epoxy resin because the low molecular weight solvent will volatilize in the bisphenol A epoxy resin, resulting in the use of Physical discomfort and environmental pollution. [0004] In view of this, how to provide a manufacturing method of two-component epoxy resin glue so that the finish...

Claims

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Application Information

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IPC IPC(8): C09J163/00C08G59/50
CPCC08G59/5026C08G59/504C09J163/00
Inventor 肖智桂温才垯
Owner 深圳市劲华电子材料有限公司
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