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Novel rotary magnetic control circular column arc target device

A magnetically controlled, circular technology, applied in ion implantation plating, metal material coating process, coating, etc., can solve the problems of affecting the magnetic field strength, easy arcing, waste of raw materials, etc., to improve the quality of film formation and reduce Effects of using cost and improving utilization rate

Pending Publication Date: 2019-02-01
SHANGHAI ZICHUANG COATING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, domestic manufacturers have the following disadvantages in rotating column arc ion plating: there are large particles on the sputtering target, which are difficult to handle, the utilization rate of the target is not good, and raw materials are wasted; the magnet is easily demagnetized after being soaked in high-temperature water for a long time. Affects the strength of the magnetic field; the driving device is a dynamic seal, which is prone to air leakage and has a short service life; the conductive contact of the lead wire is not good, and it is easy to arc.

Method used

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  • Novel rotary magnetic control circular column arc target device

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Embodiment Construction

[0028] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0029] refer to Figure 1-Figure 6, the specific embodiment adopts the following technical solutions: a new type of rotating magnetron cylindrical arc target device, including a housing 1, a first insulating pad 2, a vacuum sealing end cap device 3, a first O-ring 4, a shielding cover Insulation pad 5, shaft core retaining ring 6, shielding cover 7, drive shaft core 8, self-aligning bearing 9, magnetic sealing device 10, magnetic fluid 11, tapered roller bearing 12, small round nut 13, lock nut 14, drive Timing pulley 15, motor bracket 16, water diversion device 17, timing belt 18, motor timing pulley 19, motor tensioning device 20, motor insulating pad 21, drive motor 22, shaft circlip 23, first rotating conductive device 24. First end sealing c...

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Abstract

The invention discloses a novel rotary magnetic control circular column arc target device. The novel rotary magnetic control circular column arc target device comprises a shell, a first insulating mat, a vacuum sealed end cover device, a first O-shaped ring, a shielding case insulating mat, a shaft core retainer ring, a shielding case, a driving shaft core, a self-aligning bearing, a magnetic sealing device, magnetic liquid, a tapered roller bearing, a small round nut, a locking nut, a driving synchronous pulley, a motor bracket, a water distribution device, a synchronous belt, a motor synchronous pulley, a motor tensioning device, a motor insulating mat, a driving motor, a clamp spring for a shaft, a first rotating electric conductive device, a first end sealing cover, a second O-shaped ring, a second end sealing cover, a water inlet joint, a water outlet joint, a rotating magnetic bar device, a third O-shaped ring, a second rotating electric conductive device, a target material end sealing cover and a target material. The novel rotary magnetic control circular column arc target device facilitates the uniformity of a coating and the improvement of adhesive force, realizes the optimal process of ion plating, is stable and reliable in operation, and greatly improves the production efficiency.

Description

technical field [0001] The invention relates to the technical field of plasma surface vapor deposition, in particular to a novel rotating magnetron cylindrical arc target device. Background technique [0002] At home and abroad, vacuum coating has been widely used in machinery, electronics, energy, information and other fields, and in vacuum coating, production efficiency and quality are very concerned. Vacuum coating technology, also known as vapor deposition technology, mainly includes physical vapor deposition (PVD) and chemical vapor deposition (CVD). Physical vapor deposition refers to the method of vaporizing the plating material into atoms, molecules, or ionizing it into ions under vacuum conditions, using various physical methods, and directly depositing it on the surface of the substrate. Physical vapor deposition itself is divided into three types: : Vacuum evaporation coating, vacuum sputtering coating and vacuum ion coating have developed very fast in the past t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/35
CPCC23C14/3407C23C14/35
Inventor 张俊峰赵子东许春立张大剑
Owner SHANGHAI ZICHUANG COATING TECH
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