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Adhesive composition and application thereof

A composition and adhesive technology, applied in the direction of adhesives, adhesive additives, non-polymer organic compound adhesives, etc., can solve the problems of limited applicability, poor heat aging, etc., and achieve wide application fields and enhanced binding force , easy and convenient preparation

Inactive Publication Date: 2019-02-01
合肥永泰新型建材有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of adhesive has good waterproof and moisture resistance, but its heat aging is poor, and its applicability is limited

Method used

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  • Adhesive composition and application thereof
  • Adhesive composition and application thereof
  • Adhesive composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] This embodiment relates to an adhesive composition, which consists of the following raw materials in parts by weight:

[0052] 64 parts of gelatinized mung bean starch;

[0053] 27 parts of coumarone resin;

[0054] 6 parts Faku clay;

[0055] 9 parts of rectorite powder;

[0056] 4 parts of neopentyl glycol dimethacrylate;

[0057] 2 parts of polyvinyl ether;

[0058] 3 parts of diacetone acrylamide;

[0059] 1.5 parts of phenyl phosphorus dichloride;

[0060] 2.8 parts of compound crosslinking agent;

[0061] 1 part of compound coupling agent;

[0062] 0.8 parts of compound accelerator;

[0063] 1 part of compound antioxidant.

[0064] The selection and preparation of gelatinized mung bean starch, compound crosslinking agent, compound coupling agent and compound antioxidant in the present embodiment are shown in Table 1 below:

[0065] Table 1

[0066]

[0067] The preparation method of adhesive in the present embodiment generally carries out according t...

Embodiment 2

[0073] This embodiment relates to an adhesive composition, which consists of the following raw materials in parts by weight:

[0074] 68 parts of gelatinized mung bean starch;

[0075] 30 parts of coumarone resin;

[0076] 7 parts Faku clay;

[0077] 10 parts of rectorite powder;

[0078] 4.5 parts of neopentyl glycol dimethacrylate;

[0079] 2.5 parts of polyvinyl ether;

[0080] 3.5 parts of diacetone acrylamide;

[0081] 1.8 parts of phenyl phosphorus dichloride;

[0082] 3.3 parts of compound crosslinking agent;

[0083] 1.3 parts of compound coupling agent;

[0084] 0.9 parts of compound accelerator;

[0085] 1.4 parts of compound antioxidant.

[0086] The selection and preparation of gelatinized mung bean starch, compound crosslinking agent, compound coupling agent and compound antioxidant in the present embodiment are shown in Table 2 below:

[0087] Table 2

[0088]

[0089] The preparation method of adhesive in the present embodiment generally carries ou...

Embodiment 3

[0095] This embodiment relates to an adhesive composition, which consists of the following raw materials in parts by weight:

[0096] 70 parts of gelatinized mung bean starch;

[0097] 31 parts of coumarone resin;

[0098] 8 parts Faku clay;

[0099] 11 parts of rectorite powder;

[0100] 5 parts of neopentyl glycol dimethacrylate;

[0101] 2.8 parts of polyvinyl ether;

[0102] 4 parts of diacetone acrylamide;

[0103] 2 parts of phenyl phosphorus dichloride;

[0104] 3.5 parts of compound crosslinking agent;

[0105] 1.5 parts of compound coupling agent;

[0106] 1 part of compound accelerator;

[0107] Compound antioxidant 1.5 parts.

[0108] The selection and preparation of gelatinized mung bean starch, compound crosslinking agent, compound coupling agent and compound antioxidant in the present embodiment are shown in Table 3 below:

[0109] table 3

[0110]

[0111]

[0112] The preparation method of adhesive in the present embodiment generally carries ou...

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Abstract

The invention discloses an adhesive composition and application thereof, and relates to the technical field of adhesives. The adhesive composition comprises the following raw materials: gelatinized mung bean starch, coumarone resin, Faku clay, rectorite powder, neopentyl glycol dimethacrylate, polyvinyl ethyl ether, diacetone acrylamide, phenyl phosphorus dichloride, a compound crosslinking agent,a compound coupling agent, a compounding accelerant and a compound antioxidant. Bonding strength, waterproofness, oxidation aging resistance, temperature resistance, etc. of the adhesive are remarkably enhanced, the overall performance of the adhesive is improved, application performance is raised, and service life is guaranteed. The adhesive of the invention has good promotion value.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an adhesive composition and its application. Background technique [0002] Adhesives include organic adhesives and inorganic adhesives. Organic adhesives mainly include silicone resin, silicone rubber, polyimide, phenolic resin, epoxy resin, etc., while inorganic adhesives mainly include silicate Classes, alkali metal phosphates and silica sol, etc. There are many kinds of organic adhesives, and the bonding strength to materials is generally high. For example, epoxy adhesives are called universal adhesives, which have many varieties and are widely used; phenolic resin is the earliest industrialized synthetic resin. Combined with the advantages of high strength and high carbon residue, due to the incompatibility between organic materials and inorganic materials, organic adhesives are usually used for bonding organic materials, while inorganic adhesives are mostly used for bondi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J4/02C09J11/06C09J11/04C09J11/08
CPCC09J4/06C09J11/04C09J11/06C09J11/08
Inventor 伍志远
Owner 合肥永泰新型建材有限公司
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