Preparation method of adhesive for photovoltaic backplate
A photovoltaic backplane and adhesive technology, applied in the direction of adhesive additives, adhesive types, starch adhesives, etc., can solve the problems of applicability limitations, poor temperature resistance and other problems, and achieve good application performance and peel strength High, improve the effect of aging resistance
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Embodiment 1
[0072] This embodiment relates to an adhesive for a photovoltaic backplane, which is composed of the following raw materials in parts by weight:
[0073] 64 parts of gelatinized mung bean starch;
[0074] 27 parts of coumarone resin;
[0075] 6 parts Faku clay;
[0076] 9 parts of rectorite powder;
[0077] 4 parts of neopentyl glycol dimethacrylate;
[0078] 2 parts of polyvinyl ether;
[0079] 3 parts of diacetone acrylamide;
[0080] 1.5 parts of phenyl phosphorus dichloride;
[0081] 2.8 parts of compound crosslinking agent;
[0082] 1 part of compound coupling agent;
[0083] 0.8 parts of compound accelerator;
[0084] 1 part of compound antioxidant.
[0085] The selection and preparation of gelatinized mung bean starch, compound crosslinking agent, compound coupling agent and compound antioxidant in the present embodiment are shown in Table 1 below:
[0086] Table 1
[0087]
[0088] The preparation method of adhesive in the present embodiment generally car...
Embodiment 2
[0094] This embodiment relates to an adhesive for a photovoltaic backplane, which is composed of the following raw materials in parts by weight:
[0095] 68 parts of gelatinized mung bean starch;
[0096] 30 parts of coumarone resin;
[0097] 7 parts Faku clay;
[0098] 10 parts of rectorite powder;
[0099] 4.5 parts of neopentyl glycol dimethacrylate;
[0100] 2.5 parts of polyvinyl ether;
[0101] 3.5 parts of diacetone acrylamide;
[0102] 1.8 parts of phenyl phosphorus dichloride;
[0103] 3.3 parts of compound crosslinking agent;
[0104] 1.3 parts of compound coupling agent;
[0105] 0.9 parts of compound accelerator;
[0106] 1.4 parts of compound antioxidant.
[0107] The selection and preparation of gelatinized mung bean starch, compound crosslinking agent, compound coupling agent and compound antioxidant in the present embodiment are shown in Table 2 below:
[0108] Table 2
[0109]
[0110]
[0111] The preparation method of adhesive in the present...
Embodiment 3
[0117] This embodiment relates to an adhesive for a photovoltaic backplane, which is composed of the following raw materials in parts by weight:
[0118] 70 parts of gelatinized mung bean starch;
[0119] 31 parts of coumarone resin;
[0120] 8 parts Faku clay;
[0121] 11 parts of rectorite powder;
[0122] 5 parts of neopentyl glycol dimethacrylate;
[0123] 2.8 parts of polyvinyl ether;
[0124] 4 parts of diacetone acrylamide;
[0125] 2 parts of phenyl phosphorus dichloride;
[0126] 3.5 parts of compound crosslinking agent;
[0127] 1.5 parts of compound coupling agent;
[0128] 1 part of compound accelerator;
[0129] Compound antioxidant 1.5 parts.
[0130] The selection and preparation of gelatinized mung bean starch, compound crosslinking agent, compound coupling agent and compound antioxidant in the present embodiment are shown in Table 3 below:
[0131] table 3
[0132]
[0133] The preparation method of adhesive in the present embodiment generally ca...
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