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A kind of high-strength phenolic hollow microsphere and preparation method thereof

A hollow microsphere, high-strength technology, applied in the field of hollow microspheres prepared by spray drying, can solve the problems of reduced density, low compressive strength, impact, etc., and achieve the effect of improving compressive strength and avoiding thermal oxygen aging

Active Publication Date: 2021-02-26
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] As a lightweight functional filler, phenolic hollow microspheres are easily damaged due to external extrusion during the subsequent material molding process, which greatly affects its effect of reducing density
At present, phenolic hollow microspheres generally have the disadvantage of low compressive strength, and their breakage rate exceeds 80% at 2MPa. The root of the low compressive strength is that phenolic hollow microspheres are mostly prepared by spray drying. Inside, the high-temperature hot air will cause serious thermo-oxidative aging to the phenolic resin, which reduces the compressive strength of the hollow microsphere product

Method used

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  • A kind of high-strength phenolic hollow microsphere and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0018] According to the ratio of phenolic resin:foaming agent:surfactant=100:1:2 (weight ratio), the above components are fully stirred evenly to obtain the resin material for spray drying. Wherein the foaming agent is foaming agent H, and the surfactant is BD3088 (a silicone surfactant). Then the material is input into the centrifugal atomizer at a constant speed, and nitrogen is used as the dry air flow to carry out spray drying in a closed spray drying tower to obtain phenolic hollow microspheres. Control the air inlet temperature of the closed spray drying equipment to 280°C. The particle density of the product obtained by adopting this process and formula is 0.32g / cm 3 ; Broken ball rate is 4.1%; accumulation coefficient is 50%; breakage rate is 52% under 2MPa pressure. The prepared phenolic hollow microspheres are as attached figure 1 As shown in the SEM photos, the particle size is less than 300 microns, the roundness is regular and there are few broken balls.

Embodiment 2

[0020] According to the ratio of phenolic resin:foaming agent:surfactant=100:3:3 (weight ratio), the above components are fully stirred evenly to obtain the resin material for spray drying. Wherein the foaming agent is foaming agent AC, and the surfactant is sodium lauryl sulfate. Then the material is input into the centrifugal atomizer at a constant speed, and nitrogen is used as the dry air flow to carry out spray drying in a closed spray drying tower to obtain phenolic hollow microspheres. Control the air inlet temperature of the closed spray drying equipment to be 300°C. The particle density of the product obtained by adopting this process and formula is 0.27g / cm 3 ; Broken ball rate is 5.5%; accumulation coefficient is 51%; breakage rate is 57% under 2MPa pressure.

Embodiment 3

[0022] According to the ratio of phenolic resin:foaming agent:surfactant=100:0.5:1.5 (weight ratio), the above components are fully stirred evenly to obtain the resin material for spray drying. Wherein the foaming agent is foaming agent H, and the surfactant is Tween 80. Then the material is input into the centrifugal atomizer at a constant speed, and nitrogen is used as the dry air flow to carry out spray drying in a closed spray drying tower to obtain phenolic hollow microspheres. Control the air inlet temperature of the closed spray drying equipment to be 320°C. The particle density of the product obtained by adopting this process and formula is 0.38g / cm 3 ; Broken ball rate is 4.5%; accumulation coefficient is 54%; breakage rate is 50% under 2MPa pressure.

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Abstract

The invention relates to a high-strength phenolic hollow microsphere and a preparation method thereof. The foaming agent and surfactant are added to the thermosetting phenolic resin, and the spray drying process is adopted to realize the foaming and curing of the phenolic resin at the same time in the closed cycle spray drying equipment protected by nitrogen. The invention also provides the phenolic hollow microsphere obtained by the method, which has the advantages of small particle size, low ball breaking rate and high compressive strength.

Description

technical field [0001] The invention relates to a hollow microsphere, in particular to a hollow microsphere prepared by spray drying. Background technique [0002] Phenolic resin hollow microspheres are a new chemical material with a special hollow structure whose core is air or other gases and the outer layer is phenolic resin. Phenolic hollow microspheres have the characteristics of small particle size, low density, low thermal conductivity, excellent thermal stability, low temperature and thermal conductivity, and can absorb electromagnetic waves. [0003] As a lightweight functional filler, phenolic hollow microspheres are easily damaged due to external extrusion during the subsequent material molding process, which greatly affects its effect of reducing density. At present, phenolic hollow microspheres generally have the disadvantage of low compressive strength, and their breakage rate exceeds 80% at 2MPa. The root of the low compressive strength is that phenolic hollo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J9/10C08J9/30C08L61/06
CPCC08J9/103C08J9/107C08J9/30C08J2203/04C08J2203/18C08J2361/06
Inventor 李昊赵彤高建伟
Owner INST OF CHEM CHINESE ACAD OF SCI
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