Cutting method of slicing machine with two spindles instead of three spindles

Abstract

The invention relates to the technical field of semiconductor machining. A cutting method of a slicing machine with two spindles instead of three spindles includes the following steps that (1) steel wires are winded on the slicing machine, the slicing machine comprises a driving mechanism used for driving steel wires to move, the driving mechanism comprises an unwinding roller, the two parallelly-arranged spindles and a winding roller, the steel wires sequentially pass through the unwinding roller, the two spindles and the winding roller, the two ends of the steel wires are fixed to the unwinding roller and the winding roller correspondingly, the portions, winded on the two spindles, of the steel wires form a wire net which is used for cutting silicon ingots; (2) the silicon ingots are clamped and fixed to a silicon ingot clamping mechanism, and the silicon ingot clamping mechanism is mounted on a translation mechanism; and (3) the driving mechanism drives the steel wires to move, andthe translation mechanism drives crystal ingots to move towards the wire net for down-pressing till the crystal ingots are cut into several pieces by the wire net. The slicing machine with the two spindles is adopted for cutting, the consumption of the wires which are densely distributed on the whole wire net is lowered by 15%-20%, and the wire consumption of a single silicon slice is greatly lowered.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a silicon ingot cutting method. Background technique [0002] The production of crystalline silicon solar modules includes crystalline silicon production, ingot casting / pulling, slicing, cell production and module production. Since the current cost of solar silicon wafer power generation is still high, it has no competitive advantage compared with traditional energy sources, so it wants to develop The solar power generation industry needs to reduce costs in all aspects to achieve photovoltaic parity. The slicing link is the process of cutting the silicon ingot into thin slices. The slicing is to bring the SIC abrasive into the processing area (silicon rod) through the high-speed reciprocating motion of the metal wire for grinding, and the diamond wire is to attach the diamond to the steel wire through electroplating technology. cutting. Compared with traditiona...

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Problems solved by technology

[0003] The cost of diamond wire accounts for a relatively high proportion of the cutting cost. The amount of wire used per wafer is directly related to the cost of silicon wafer cutting. The original method of slicing is to use the three-axis winding mode for cutting. The three-axis winding mode is the above two wires on the same plane. The main shaft and the lower main shaft are in a triangular state. The diamond wire passes through the three main shafts in turn from the pay-off wheel, and then returns to the take-up wheel. The diamond wire is covered with the entire wire network and consumes a large amount of wire, resulting in the cost of silicon wafer cutting. The height cannot be lowered, and the rigid wire in the three-axis winding mode will be bent many times, which increases the risk of wire breakage

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