High-thermal stability chip-scale LED (Light Emitting Diode) packaging method and product

A LED packaging and chip-level technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as difficulty in controlling the uniformity of the phosphor layer, affecting the repeatability of LED products, consistency of light and color, and poor thermal stability. Light color consistency and process integration, meet thermal stability requirements, and strong thermal reliability

Active Publication Date: 2019-01-29
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, further studies have shown that the prior art LED packaging process still has the following technical defects or deficiencies: First, the current phosphor glue will produce particle precipitation and local concentration changes during curing, and it is difficult to control the fluorescence during actual processing The uniformity of the powder layer will affect the repeatability and light color consistency of LED products; secondly, due to the high optical density of the LED device packaged by CSP, the heat generated by the LED chip and the secondary heat generated by the phosphor powder during the light color conversion process are relatively large. However, organic phosphor adhesives have low thermal conductivity and poor thermal stability, and are prone to serious problems such as aging, yellowing, and carbonization under long-term thermal radiation and light exposure, which directly lead to the reduction of LED light output efficiency, light color shift and reliability. sex decline

Method used

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  • High-thermal stability chip-scale LED (Light Emitting Diode) packaging method and product
  • High-thermal stability chip-scale LED (Light Emitting Diode) packaging method and product

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Embodiment 1

[0052] see figure 1 , the embodiment 1 provides a highly thermally stable chip-scale LED packaging structure, the LED chip 12, the ceramic substrate 11 and the fluorescent glass layer 17. The LED chip 12 is mounted on the circuit layer of the ceramic substrate 11 through eutectic bonding, and the electrical interconnection is realized through the solder joints 13. Preparation of sintered fluorescent glass paste 15 .

[0053] The chip-level LED packaging method of the present embodiment 1 may include the following steps as an example:

[0054] Step 1, the selected high-quality blue-ray flip-chip LED chips 12 are mounted on the circuit layer of the ceramic substrate 11 through the eutectic bonding head 14 of the eutectic bonding machine;

[0055] Step 2, coating the fluorescent glass paste 15 with a uniform thickness on the ceramic substrate 11, the paste layer covers the top and side of the LED chip 12, and the scraper 16 is controlled to adjust the thickness and uniformity o...

Embodiment 2

[0060] see figure 2 , this embodiment provides another chip-scale LED packaging structure with high thermal stability, including LED chips 22 , ceramic substrate 21 , light-shielding layer 25 and fluorescent glass sheet 26 . The LED chip 22 is eutectically bonded on the circuit layer of the ceramic substrate 21, and is electrically interconnected through solder joints 23. The light blocking layer 25 is coated on the side of the LED chip 22, and the fluorescent glass sheet 26 is bonded to the LED chip 22 top.

[0061] The manufacturing method of the present embodiment comprises the following steps:

[0062] Step 1, the selected high-quality ultraviolet flip-chip LED chip 22 is mounted on the circuit layer of the ceramic substrate 21 through the eutectic welding head 24 of the eutectic bonding machine;

[0063] Step 2, coating the light-blocking layer 25 between the LED chips 22, controlling its height to be the same as the thickness of the LED chip 22 by grinding the light-b...

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Abstract

The invention belongs to the related field of semiconductor manufacturing technologies, and discloses a high-thermal stability chip-scale LED (Light Emitting Diode) packaging method. The method comprises the steps of firstly mounting a plurality of LED chips on a ceramic substrate by eutectic bonding, then coating the ceramic substrate with fluorescent glass paste, obtaining a fluorescent glass layer on the top and side surfaces of the chips through low-temperature sintering, and then cutting to obtain LED devices; or firstly, eutectic bonding a plurality of LED chips on a ceramic substrate, then coating the side surfaces of the chips with a light shielding layer, then bonding a prepared fluorescent glass sheet to the top of the chips, and finally cutting to obtain LED devices. The invention further discloses a corresponding LED packaging structure. According to the invention, problems of fluorescent layer aging and carbonization caused by chip heating under high current density are effectively avoided, the thermal stability of the LED devices is improved, and the method is particularly suitable for solving the technical problems such as production efficiency and photochromic consistency in the chip-scale LED packaging process.

Description

technical field [0001] The invention belongs to the related field of semiconductor manufacturing technology, and more specifically relates to a chip-level LED packaging method with high thermal stability and its products. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is an electroluminescent semiconductor device that utilizes the interband transition radiation recombination of electrons and holes to emit light. Compared with traditional lighting sources such as incandescent lamps and fluorescent lamps, LEDs have the advantages of high luminous efficiency, long life, environmental protection and energy saving, and compact structure. They are considered to be a new generation of green lighting sources. Among them, white LED has been widely used in lighting and backlight display and other fields, such as road lighting, indoor lighting, car headlights, TV backlights, mobile phone flashlights, etc. [0003] LED packaging is one of the key links...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/54
CPCH01L33/501H01L33/505H01L33/54H01L2933/0041
Inventor 陈明祥彭洋牟运罗小兵刘胜
Owner HUAZHONG UNIV OF SCI & TECH
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