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A glue spraying machine for semiconductor processing

A glue spraying machine and semi-conductor technology, which is applied in the direction of liquid spraying devices, paint spraying booths, spraying devices, etc., to achieve the effects of good glue spraying quality, stable glue spraying, and uniform glue spraying

Active Publication Date: 2021-01-22
江苏奥斯力特电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the shortcomings of poor glue quality, uniform glue spray and stable glue spray in the glue spray device for semiconductor processing in the prior art, the technical problem to be solved by the invention is to provide a glue spray with good quality, uniform glue spray, Glue spraying machine for semiconductor processing with stable and dust-free glue spraying

Method used

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  • A glue spraying machine for semiconductor processing
  • A glue spraying machine for semiconductor processing
  • A glue spraying machine for semiconductor processing

Examples

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Embodiment

[0031] A glue sprayer for semiconductor processing, such as Figure 1-4 As shown, it includes a glue spray box 1, a sealing plate 3, a first motor 5, a first rotating shaft 6, a circular gear 7, a first mounting plate 8, a first sliding rod 10, a block 12, a first sliding block 13, The second mounting plate 15, the fixed rod 16, the fixed plate 19, the elastic member 21, the second slide bar 22, the third mounting plate 23, the second slider 25, the first electric reel 26, the first backguy 27, the second Second pull wire 28, second electric reel 29, air duct 30, wind bucket 31, glue gun 32, first hose 33, glue pump 35, glue tank 36, second hose 37, blower 39, elastic cord 40. Rubber pipe 101, rack 102 and air pump 103; the first installation plate 8 is fixed in the glue spray box 1, the first installation plate 8 is provided with the first chute 9, the first slide bar 10 and the first The chute 9 is slidingly connected, the rack 102 is fixedly connected to the bottom end of ...

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Abstract

The invention belongs to the field of semiconductor processing, and particularly relates to a glue sprayer for semiconductor processing. The technical purpose of providing the glue sprayer which is good in glue spray quality, uniform in glue spray, stable in glue spray and capable of performing dust-free glue spray work for semiconductor processing is achieved. The glue sprayer for semiconductor processing comprises a glue spray box, a sealing plate, a first motor, a first rotating shaft, a circular gear, a first mounting plate, a first sliding rod and an air pump; the first mounting plate isfixedly connected to the interior of the glue spray box, a first sliding groove is formed in the first mounting plate, the first sliding rod is slidably connected with the first sliding groove, a rackis fixedly connected to the bottom of the first sliding rod, the first motor is fixedly connected to the interior of the glue spray box, the first rotating shaft is in transmission connection with anoutput end of the first motor, the circular gear is fixedly connected to the first rotating shaft, and the circular gear is meshed with the rack. Accordingly, the effects of being good in glue sprayquality, uniform in glue spray, stable in glue spray and capable of performing dust-free glue spray work are achieved.

Description

technical field [0001] The invention relates to the field of semiconductor processing equipment, in particular to a glue spraying machine for semiconductor processing. Background technique [0002] Photolithography is one of the important process methods in the semiconductor manufacturing process, which usually includes the following steps: forming a photoresist layer on the semiconductor wafer; selectively exposing the photoresist layer, and making the exposed light through a developing step The resist layer further forms a photoresist pattern, and this step is also called patterning of the photoresist layer; using the patterned photoresist layer as a mask, the semiconductor wafer is etched; After the photoresist layer is etched, the photoresist layer is ashed to remove the photoresist layer, and the photoresist layer can be formed by spraying or spin coating, wherein when using the spraying method, the spraying device sprays the photoresist , coated on the wafer to form a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B16/60B05B16/00B05B14/40B05B13/02B05B9/00
CPCB05B9/002B05B13/025B05B14/40B05B16/00B05B16/60
Inventor 徐秋井
Owner 江苏奥斯力特电子科技有限公司
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