A manufacturing method of a fine circuit of a flexible circuit board

A technology of flexible circuit boards and fine circuits, which is applied in the fields of printed circuit manufacturing, printed circuits, and removal of conductive materials by chemical/electrolytic methods. It can solve problems such as poor functionality, improve analytical capabilities, and reduce pool effects. the effect of the influence

Active Publication Date: 2019-01-15
广州广合科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, micropores are prone to poor functionality due to small pores and poor exchange of electroplating chemicals during the porosity process. Therefore, electroplating equipment with better chemical circulation must be selected for production.

Method used

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  • A manufacturing method of a fine circuit of a flexible circuit board

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for manufacturing a fine circuit of a flexible circuit board, comprising the following steps:

[0026] S1. Use thin copper material and cut it: the thickness of the selected copper material is 3 μm;

[0027] S2.UV laser drilling;

[0028] S3. Removing glue residue;

[0029] S4. Black hole: before the black hole, first conduct plasma treatment, and then black hole;

[0030] S5. Electroplating copper: The thickness of copper on the surface of VCP electroplating wire is 1.5 μm of that of Longmen wire, and the COV value is 4.2% of that of Longmen wire.

[0031] S6. Film exposure and development: In step S6, the thickness of the photosensitive film used is 15 μm, the photosensitive film is a wet film, and the minimum line spacing of the resolution capability of the wet film is 16 μm.

[0032] S7. Vacuum etching: During the etching process, the spray pressure is 2.4 Kg / cm 2 , The lower pressure is 2.2Kg / cm 2 , the etching speed is between 4.5m / min;

[0033] S8....

Embodiment 2

[0038] A method for manufacturing a fine circuit of a flexible circuit board, comprising the following steps:

[0039] S1. Use thin copper material and cut it: the thickness of the selected copper material is 1 μm;

[0040] S2.UV laser drilling;

[0041] S3. Removing glue residue;

[0042] S4. Black hole: before the black hole, first conduct plasma treatment, and then black hole;

[0043] S5. Electroplating copper: the thickness of copper on the surface of the VCP electroplating line is 1 μm of the Longmen line, and the COV value is 3% of the Longmen line;

[0044] S6. Film exposure and development: the thickness of the photosensitive film used is 10 μm, the photosensitive film is a wet film, and the minimum line spacing of the wet film is 10 μm;

[0045]S7. Vacuum etching: During the etching process, the spray pressure is 2.4 Kg / cm 2 , The lower pressure is 2.2Kg / cm 2 , the etching speed is between 3.0m / min;

[0046] S8. Withdraw the film.

[0047] Further, in step S6,...

Embodiment 3

[0051] A method for manufacturing a fine circuit of a flexible circuit board, comprising the following steps:

[0052] S1. Use thin copper material and cut it: the thickness of the selected copper material is 9 μm;

[0053] S2.UV laser drilling;

[0054] S3. Removing glue residue;

[0055] S4. Black hole: before the black hole, first conduct plasma treatment, and then black hole;

[0056] S5. Electroplating copper: the copper thickness of the surface of VCP electroplating wire is 5 μm of that of Longmen wire, and the COV value is 3-15% of that of Longmen wire;

[0057] S6. Film exposure and development: the thickness of the photosensitive film used is 20 μm, the photosensitive film is a wet film, and the minimum line spacing of the wet film is 20 μm;

[0058] S7. Vacuum etching: During the etching process, the spray pressure is 2.4 Kg / cm 2 , The lower pressure is 2.2Kg / cm 2 , the etching speed is between 5.5m / min;

[0059] S8. Withdraw the film.

[0060] Further, in ste...

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Abstract

The invention provides a manufacturing method of a fine circuit of a flexible circuit board, which is characterized in that the method comprises the following steps: S1, adopting a thin copper material and cutting: the thickness of the selected copper material is 1-9um; S2. UV laser drilling; 3, remove glue residue; 4, black hole: before that black hole, plasma treatment is carry out first, and then the black hole is carried out; S5. Copper plating: The thickness difference of VCP plating line is 1- 5 u m, COV value is 3- 15%; S6. Film-coated exposure development: The thickness of the photosensitive film used is 10- 20. Mu. M, the photosensitive film is a wet film, and the minimum line space of the wet film is 10-20um; S7. Vacuum etching: during the etching process, the spray pressure is 2.4 Kg/cm2 and the down pressure is 2.2 Kg/cm2, and the etching speed is 3.0- 5.5 m/min; S8, Film removal. On the premise of ensuring good etching effect of the fine circuit, the invention starts to reduce the thickness of the plating layer in the pre-process of the circuit fabrication so as to improve the uniformity of the surface copper.

Description

technical field [0001] The invention belongs to the technical field of circuit board preparation, and in particular relates to a method for manufacturing fine circuits of a flexible circuit board. Background technique [0002] The fine line type products not only have dense lines, but also the diameter of the via hole is at the micro-hole level. The diameter of the micro-hole is generally within 0.050±0.010mm, which can only be made by laser drilling technology. However, micropores are very prone to poor functionality due to small pores and poor exchange of electroplating chemicals during the porosity process. Therefore, electroplating equipment with better chemical circulation must be selected for production. In order to prevent the appearance of corrosion burrs when etching fine lines, under the premise of ensuring that the copper thickness of the standard hole is reached during copper electroplating, the thinner the surface copper thickness, the better. Generally, the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/02H05K3/06
CPCH05K3/0044H05K3/0047H05K3/022H05K3/06
Inventor 王平黎钦源彭镜辉
Owner 广州广合科技股份有限公司
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