Water-based paint with high thermal conductive and insulating properties

Abstract

The invention discloses a water-based paint with high thermal conductive and insulating properties. The water-based paint comprises a water-based emulsion, auxiliaries and high thermal conductive andinsulating fillers, wherein the high thermal conductive and insulating fillers are composed of nano-scale fillers and micro-scale fillers; the mass ratio of nano-scale fillers to micro-scale fillers is (0.1-10):1; the high thermal conductive and insulating fillers at least include nitrides. The water-based paint with high thermal conductive and insulating properties disclosed by the invention is prepared in the manner of adopting a compounded high thermal conductive system, intensively studying on the influence of the filler size and distribution on the thermal conductive property of the water-based paint and utilizing the synergistic effect generated by the compounding of the variety, specific size and distribution of the thermal conductive fillers. The radiating property is obviously promoted while other physical and chemical properties, including insulating property, are basically kept constant.

Description

technical field [0001] The invention relates to the technical field of water-based paint, in particular to a water-based paint with high thermal conductivity and insulation. Background technique [0002] With the gradual development of electronic devices in the direction of miniaturization, light weight and high performance, the power density continues to increase, and the calorific value per unit volume is also increasing, which seriously affects the working performance, reliability and life of the device. How to achieve efficient heat dissipation , has increasingly become a breakthrough in the development and application of high-power electronic devices. Traditional heat dissipation methods (such as fin technology, convective heat transfer, and air cooling) have been difficult to meet the heat dissipation requirements under the current stringent standards (the miniaturization of devices has made traditional heat dissipation methods ineffective). [0003] Recently, researc...

AI Technical Summary

Problems solved by technology

The thermally conductive filler used in Example 1 of this technical solution is a mixture of spherical alumina with a particle size of 9-11 μm and spherical alumina with a particle size of 1.8-2.0 μm at a mass ratio of 3:1, but the thermal conductivity of the prepared product It is only 0.95W / m K; and after replacing the thermally conductive fillers with modified carbon nanotubes and modified graphene in Examples 5 and 6, although the thermal conductivity is slightly improved, it still does not exceed 1.3W / m K. K, while still unable to avoid the impact of the addition of high thermal conductivity carbon materials on the electrical insulation of the coating

[0009] It can be seen that people use one or more high thermal conductivity fillers to form heat conduction channels, but ignore the influence of filler size and distribution on the thermal conductivity of coatings, resulting in blindness in the design and preparation of coatings.

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