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A method and device for improving the connection strength of laser shock riveting

A technology of laser shock and connection strength, which is applied in the field of advanced manufacturing, can solve the problems of difficult metallurgical bonding and high laser power requirements, and achieve the effect of simple forming device, flexible process, integrity and sealing

Active Publication Date: 2020-05-19
SHANDONG UNIV
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  • Description
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  • Application Information

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Problems solved by technology

However, this method requires high power of the laser and requires the contact surface of the plate to be clean. Even so, the metallurgical bonding between some materials is still very difficult to achieve

Method used

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  • A method and device for improving the connection strength of laser shock riveting
  • A method and device for improving the connection strength of laser shock riveting
  • A method and device for improving the connection strength of laser shock riveting

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Embodiment Construction

[0044] It should be pointed out that the following detailed description is exemplary and intended to provide further explanation to the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0045] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that when the terms "comprising" and / or "comprising" are used in this specification, they mean There are features, steps, operations, means, components and / or combinations thereof;

[0046]For the convenience of description, if the words "up", "down", "left" and "right" appear in the present in...

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Abstract

The invention discloses a method and device for improving the laser shock riveting forming connecting strength. The method includes the following main steps that firstly, a resin mixture and a curingagent are mixed according to a certain proportion, and a formed pasty mixture serves as a filling material; afterwards, a central controller controls a laser device to transmit laser beams, the laserbeams are transmitted to a worktable through a light guide arm and a focus head to excite an adsorption layer material to be plasma shock waves to shock an upper layer plate, and a hollow riveting structure is formed by the upper layer plate and a trepanned lower layer plate under the constraint of a lower female die; and the central controller adjusts a peristaltic pump to extrude the filling material so that the filling material can be injected into the hollow riveting structure through a material spraying nozzle, after the filling material is solidified, hollow riveting becomes solid riveting, when the riveting structure is subjected to the effect of normal force and shearing force, the cured filling material can have a supporting effect on the riveting structure, and therefore the riveting connecting strength is greatly improved.

Description

technical field [0001] The invention relates to the field of advanced manufacturing technology, in particular to a method for improving the connection strength of plates, especially ultra-thin plates, when pulsed laser impact riveting is formed. Background technique [0002] With the continuous advancement of science and technology, more and more precision instruments need to be applied to ultra-thin sheets, so the demand for advanced connection technology for ultra-thin sheets is also increasing. Among them, rivetless riveting of sheets is a very efficient method. Connection process. For example, the Chinese patent document with application number 200810014018.1 proposes a pulse laser micro-riveting method and special device for ultra-thin plates. This method uses pulsed laser beams as a flexible punch to impact the plate into a riveting structure with a small mouth and a large bottom. , thereby riveting two or more layers of sheets together. Although this method is conve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21D39/02
CPCB21D39/028
Inventor 季忠尤书鑫王祥营张纪芝
Owner SHANDONG UNIV
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