Cleaning system and cleaning method

Abstract

The invention relates to a cleaning system, which includes at least one cleaning device, at least one robot arm, and at least one wafer access device. The invention also relates to a cleaning method.The cleaning system is composed of the cleaning device, robot arm and wafer access device, realizes automatic transfer and cleaning of the wafers to replace manual cleaning, so as to avoid defects such as water stains, watermarks, pen suction marks and the like on t the wafers after surface cleaning, improve productivity, and reduce production cost.

Description

technical field [0001] The invention relates to the field of semiconductor wafer cleaning, in particular to a semiconductor wafer cleaning system and cleaning method. Background technique [0002] Group III-V compound semiconductor materials represented by gallium arsenide (GaAs) are widely used in the fields of satellite communications, microwave devices, lasers and light-emitting diodes due to their unique electrical properties. The manufacture of devices such as heterojunction bipolar transistors, high electron mobility transistors, and LEDs requires the growth of epitaxial structures on the surface of high-quality substrates by molecular beam epitaxy or organometallic compound vapor phase epitaxy. With the continuous improvement of semiconductor device manufacturing process, the size of the device is getting smaller and higher, and the utilization rate is getting higher and higher. The quality of the semiconductor substrate, especially the quality of the wafer surface, h...

AI Technical Summary

Problems solved by technology

At present, almost all semiconductor wafers are cleaned manually. Since wafer cleaning has high process requirements, such as: cleaning method, concentration of chemical solution, temperature of chemical solution, cleaning time of chemical solution, flushing time, etc., if artificial Cleaning, everyone has different habits and different cleaning methods, which may affect the consistency of wafer cleaning, and manual cleaning, after the epitaxial process of semiconductor preparation, defects such as water marks, watermarks, and pen-absorbing marks often appear on the surface

The storage and delivery of semiconductor wafers has not yet formed an automated operation, which is not conducive to the processing and production of semiconductor wafers

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