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Novel aramid-paper-based copper-clad plate and preparation method thereof

A technology of aramid paper and copper clad laminate, applied in chemical instruments and methods, paper/cardboard layered products, paper, etc., can solve problems such as poor thermal conductivity, achieve small thermal expansion coefficient, increase strength, and good electrical conductivity.

Inactive Publication Date: 2018-12-25
LONGPONT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the current problem of poor thermal conductivity and negative axial CTE value of all aramid-based copper-clad laminates, the present invention provides a new type of modified aramid-based paper-based copper-clad laminate and its preparation method

Method used

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  • Novel aramid-paper-based copper-clad plate and preparation method thereof
  • Novel aramid-paper-based copper-clad plate and preparation method thereof
  • Novel aramid-paper-based copper-clad plate and preparation method thereof

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preparation example Construction

[0049] In one embodiment, the preparation method of the novel aramid paper-based copper-clad laminate includes at least the following steps:

[0050] Step S01. Deflaking the para-aramid chopped fibers to make slurry A;

[0051] Step S02. Deflaking the para-aramid fibrid fibers, and adding silicon nitride fibers to make slurry B;

[0052] Step S03. The slurry A and the slurry B are mixed, and additives are added, followed by papermaking and hot rolling to obtain modified para-aramid paper;

[0053] Step S04. Perform mixing treatment of high Tg resin, filler, and surface modifier to obtain a resin mixture, mix the resin mixture with the curing agent to obtain an impregnation solution, and mix the modified parasite obtained in step S03 Immersing the aramid paper in the impregnation solution, and drying to form a resin composite layer stacked on the surface of the modified para-aramid paper to obtain a prepreg;

[0054] Step S05. Stack several semi-solid sheets to obtain a subst...

Embodiment 1

[0067] A preparation method of a novel aramid paper-based copper-clad laminate, the steps of which are as follows:

[0068] (1) Preparation of modified para-aramid paper: provide 10 parts of para-aramid chopped fiber, 90 parts of para-aramid precipitated fiber, and 15 parts of silicon nitride fiber; wherein the average length of the silicon nitride fiber is 100 μm ;

[0069] The above-mentioned para-aramid chopped fibers are decompressed with a hydraulic deflagging machine to obtain a slurry A with a concentration of 1 wt %;

[0070] The above-mentioned para-aramid precipitated fiber was decompressed with a hydraulic deflagging machine, and silicon nitride fiber was added, and after polishing and pulping, the beating degree was controlled to be about 75°SR, and a slurry B with a concentration of 2wt% was obtained;

[0071] The slurry A and the slurry B are mixed evenly in the batching tank, transferred to the pulp stabilization box, and polyethylene oxide is added therein, af...

Embodiment 2

[0075] A preparation method of a novel aramid paper-based copper-clad laminate, the steps of which are as follows:

[0076] (1) Preparation of modified para-aramid paper: provide 90 parts of para-aramid chopped fiber, 10 parts of para-aramid precipitated fiber, and 15 parts of silicon nitride fiber; wherein the average length of the silicon nitride fiber is 150 μm ; The above-mentioned para-aramid chopped fibers are decompressed with a hydraulic deflagging machine to obtain a slurry A with a concentration of 1 wt %;

[0077] The above-mentioned para-aramid precipitated fiber was decompressed with a hydraulic deflagging machine, and silicon nitride fiber was added, and after polishing and pulping, the beating degree was controlled to be about 75°SR, and a slurry B with a concentration of 2wt% was obtained;

[0078] The slurry A and the slurry B are mixed evenly in the batching tank, transferred to the pulp stabilization box, and polyethylene oxide is added therein, after paperm...

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Abstract

The invention relates to the technical field of copper-clad plates, in particular to a novel aramid-paper-based copper-clad plate and a preparation method thereof. The novel aramid-paper-based copper-clad plate comprises a substrate and copper foil and is characterized in that the substrate is formed by stacking a plurality of prepregs, and the copper foil is stacked to at least one surface of thesubstrate; each prepreg comprises modified para-position aramid paper and resin composite layers stacked to at least one surface of the aramid paper; the copper foil is adhered to the surface of theresin composite layers through glue. The aramid-paper-based copper-clad plate is good in stripping strength, small in density, excellent in dielectric property and thermal expansion coefficient, and the good thermal conductivity of the aramid-paper-based copper-clad plate can greatly expand the application range of the copper-clap plate.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, in particular to a novel aramid paper-based copper-clad laminate and a preparation method thereof. Background technique [0002] Copper clad laminate is a structural layer formed by bonding copper conductors and sheet substrates. It is the substrate material of printed circuit boards, providing the required electrical and mechanical properties for printed boards, and is one of the important components of the electronics industry. . Almost every kind of electronic equipment is involved, ranging from small electronic watches and calculators to large computers, communication electronic equipment, and military weapon systems. It is divided into two categories: one is rigid copper clad laminate; the other is flexible copper clad laminate. Among them, the rigid organic resin copper-clad laminate, which is used the most in the manufacture of printed boards, is mostly composed of sheet-li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D21H27/00D21F11/00B32B15/20B32B29/00B32B7/12B32B33/00
CPCB32B7/12B32B15/20B32B29/002B32B33/00D21F11/00D21H27/00
Inventor 常小斌肖东华陈军华肖涵邹磊
Owner LONGPONT
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