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A kind of silver alloy solder paste with good dispensing performance and preparation method thereof

A silver alloy welding, silver alloy technology, applied in welding equipment, metal processing equipment, manufacturing tools and other directions, can solve the problems of poor continuous dispensing performance, unstable product performance, short service life of silver alloy solder paste, etc. Improve the fluxing effect, increase the flux activity, and solve the effect of short service life

Active Publication Date: 2020-12-01
佛山市诺普材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies in the prior art, one of the purposes of the present invention is to provide a silver alloy solder paste with good dispensing performance, which can be applied to different silver alloy substrates by adjusting the flux system. The flux can reduce the overall melting heat of the solder paste by reducing the overall melting temperature of the compound salt, thereby increasing the welding speed and solving the problems of short service life of the existing silver alloy solder paste, poor continuous dispensing performance, and unstable product performance, etc. problems, it has the advantages of continuous dispensing, environmental friendliness, long service life, etc.

Method used

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  • A kind of silver alloy solder paste with good dispensing performance and preparation method thereof
  • A kind of silver alloy solder paste with good dispensing performance and preparation method thereof
  • A kind of silver alloy solder paste with good dispensing performance and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0051] According to the weight percentage of the total solder paste, first add 15% organic solvent and 4% acrylic resin into a polytetrafluoroethylene jar, and rotate for 180min at a constant temperature of 120°C and a speed of 1400 rpm to obtain a uniform and stable solder paste. For polyacrylic acid resin solution, measure the solid content of the resin solution under the condition of 120°C / 1h, and add the lost organic solvent in proportion. Add 1.5% polyamide wax into the polyacrylic acid resin solution, stir for 20 minutes in a constant temperature oil bath at 55°C (≤70°C) and a stirring speed of 1000 rpm, so that the thixotropic agent is evenly distributed in the swollen state In the resin solution, measure the solid content of the organic carrier, and add the lost organic solvent in proportion. Then 68Wt.% sieved silver alloy powder (20Wt.% of particle size at -300 mesh, 60Wt.% of particle size at -200 mesh + 300 mesh, 20Wt.% of particle size at -100 mesh + 200 mesh) Ad...

Embodiment 2

[0053] According to the weight percentage of the total solder paste, first add 20% organic solvent and 3% rosin resin into a polytetrafluoroethylene jar, and rotate for 180min at a constant temperature of 120°C and a speed of 1400 rpm to obtain a uniform and stable resin solution, measure the solid content of the resin solution under the condition of 120°C / 1h, and add the lost organic solvent in proportion. Add 1% hydrogenated castor oil to the rosin resin solution, stir for 20 minutes in a constant temperature oil bath at 55°C (≤70°C) and a stirring speed of 1000 rpm, so that the thixotropic agent is evenly distributed in the resin in a swollen state In the solution, measure the solid content of the organic carrier, and add the lost organic solvent in proportion. Then 60Wt.% silver alloy powder (15Wt.% of particle size at -300 mesh, 65Wt.% of particle size at -200 mesh + 300 mesh, 20Wt.% of particle size at -100 mesh + 200 mesh) by mass ratio 4:6 is added in two times, and t...

Embodiment 3

[0055] According to the weight percentage of the total solder paste, first add 20% organic solvent and 3% acrylic resin into a polytetrafluoroethylene jar, and rotate for 180min at a constant temperature of 120°C and a speed of 1400 rpm to obtain a uniform and stable resin solution, measure the solid content of the resin solution under the condition of 120°C / 1h, and add the lost organic solvent in proportion. Add 1% polyamide wax to the acrylic resin solution, and stir for 20 minutes in a constant temperature oil bath at 55°C (≤70°C) with a stirring speed of 1000 rpm, so that the thixotropic agent is evenly distributed in the resin in a swollen state In the solution, measure the solid content of the organic carrier, and add the lost organic solvent in proportion. Then 60Wt.% silver alloy powder (15Wt.% of particle size at -300 mesh, 65Wt.% of particle size at -200 mesh + 300 mesh, 20Wt.% of particle size at -100 mesh + 200 mesh) by mass ratio 4:6 is added in two times, and th...

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Abstract

The invention discloses silver-alloy welding paste with good adhesive dispensing performance. The silver-alloy welding paste with the good adhesive dispensing performance is prepared from, by mass, 1%-10% of resin, 0.5%-4% of a thixotropic agent, 10%-45% of an organic solvent, 55%-80% of silver-alloy solder and 15%-35% of a soldering flux. The invention further provides a preparation method of thesilver-alloy welding paste with the good adhesive dispensing performance. According to the silver-alloy welding paste, soldering fluxes suitable for different silver-alloy matrixes can be obtained byadjusting a soldering flux system; the overall melting heat of the welding paste is reduced by decreasing the overall melting temperature of composite salt, so that the welding speed is increased, and the problems that existing silver-alloy welding paste is short in service life, poor in continuous adhesive dispensing performance, instable in product quality and the like are solved; and the silver-alloy welding paste with the good adhesive dispensing performance has the advantages of being capable of achieving continuous adhesive dispensing, environmentally friendly, long in service cycle andthe like.

Description

technical field [0001] The invention relates to a solder paste, in particular to a silver alloy solder paste with good dispensing performance and a preparation method thereof. Background technique [0002] Silver alloy solder paste is used to solder electronic components on the substrate to obtain a good electrical connection. The components of the solder paste, the dispensing process, the dispersion process and the addition of the thixotropic agent are the main factors that affect the electrical connection performance of the weldment. factor. The dispensing process is to fill the solder paste in the injection dispenser. By controlling the pressure of compressed air, a specific quality of solder paste is pressed out from the needle nozzle, and it is precisely placed on a specific position on the surface of the substrate, and soldered under the action of gravity. The paste is leveled into a film layer of a specific shape to realize the initial connection between the componen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/30B23K35/3006B23K35/40
Inventor 丁勇堵永国王乃千余翠娟凌均谷
Owner 佛山市诺普材料科技有限公司
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