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SnBiAgCu high-reliability lead-free solder alloy

A lead-free solder alloy, reliable technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of poor wettability, poor reliability, poor fluidity, etc., and achieve long-lasting oxidation resistance and soldering Stable quality and good fluidity

Inactive Publication Date: 2018-12-14
云南锡业锡材有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to ensure the quality of welding and the reliability after welding, elements such as Zn, Fe, Al, and rare earth elements must be strictly controlled during microalloying. Therefore, there are still disadvantages such as poor wettability, large melting range (poor fluidity), and poor reliability after welding.

Method used

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  • SnBiAgCu high-reliability lead-free solder alloy
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  • SnBiAgCu high-reliability lead-free solder alloy

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Embodiment Construction

[0030] The present invention will be described in further detail below in conjunction with specific embodiments, but the protection scope of the present invention is not limited to the content described.

[0031] The weight percent of SnBiAgCu high reliability lead-free solder of the present invention consists of:

[0032] 0.1-5% Ag;

[0033] 0.4-4% Cu;

[0034] 0.5-10% In;

[0035] 0.1-10% Sb;

[0036] 0.5-10% Bi;

[0037] 0.01-0.5% Ni;

[0038] Compound addition of any one, two or three of the following elements, the total amount is in the range of 0-0.1%:

[0039] 0-200ppm P;

[0040] 0-200ppm of Ga;

[0041] 0-200ppm of Ge;

[0042] And the balance of Sn and unavoidable impurities.

[0043] During the preparation process of the lead-free solder, Ag, Cu, Sb, In, Ni, Ge, and P are prepared as SnX master alloys and added, the remaining Bi and Ga are added as pure substances, and the insufficient Sn is added as pure Sn.

[0044] The above-mentioned master alloy of Ag...

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Abstract

A SnBiAgCu high-reliability lead-free solder alloy comprises, by weight percent, 0.1% to 5% of Ag, 0.4% to 4% of Cu, 0.5% to 10% of In, 0.1% to 10% of Sb, 0.5% to 10% of Bi, 0.01% to 0.5% of Ni, totally 0 to 0.1% of P or Ge or Ga and the balance Sn and inevitable impurities. According to the SnBiAgCu high-reliability lead-free solder alloy, by adding Sb, Ni, In and other alloy elements, after welding spots are formed, enrichment of Bi can be hindered on an interface, forming of SnBi eutectic structures is avoided, and damage to the mechanical performance of a welding connector is reduced; andthe welding strength is improved, and meanwhile high oxidation resistance is achieved at different process temperatures.

Description

technical field [0001] The invention relates to the technical field of lead-free solder alloys. Background technique [0002] Since electronic solder has become lead-free, SnCu-based, SnAgCu-based, and SnBi-based solder alloys have been widely used. The SnAgCu system has good wettability, good soldering reliability and process yield, but also has disadvantages such as high melting point, high cost, and decreased drop resistance as the silver content increases. The cost of Sn-Cu system is low, but its melting point is high and its wettability is poor. The Sn-Bi series has a low melting point and good wettability, but the reliability after welding is poor due to the high Bi content. The Chinese patents whose publication numbers are CN1927525 and CN101380700B respectively disclose a series of solders. Due to the addition of rare earth elements, these solders have very active chemical properties and are easy to oxidize, which will increase the surface tension of the solder and...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/262B23K35/3601
Inventor 滕媛白海龙陈东东赵玲彦吕金梅刘宝权徐凤仙肖倩严继康解秋莉孙维
Owner 云南锡业锡材有限公司
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