Electronic device with low stress and high overload resistance and packaging method of electronic device

Abstract

The invention discloses an electronic device with low stress and high overload resistance and a packaging method of the electronic device. Protection flexible glue is dropwise added on the inner sideof a bottom plate of a packaging tube shell, and pressing is performed to form lower protection flexible glue and side protection flexible glue; the protection flexible glue is dropwise added on the inner surface of a packaging cover plate, and pressing is performed to form patterned upper protection flexible glue; then a bonding piece glue point is dropwise added to the lower protection flexibleglue to enable an electronic chip to be attached to the packaging tube shell, and it is ensured that there is no direct mechanical connection between the electronic chip and the inner side surface ofthe packaging tube shell and between the electronic chip and the packaging cover plate; then metal wires are bonded, and finally, covering of the packaging cover plate is performed. By virtue of the upper protection flexible glue, the lower protection flexible glue and the bonding piece glue point, external force impact in the Z direction can be buffered jointly, so that the electronic chip is protected from collision with the packaging cover plate or the bottom plate of the packaging tube shell; and by virtue of the side protection flexible glue, external force impact in the X-axis directionand the Y-axis direction can be buffered, so that the electronic chip is protected from collision with the side surface of the packaging tube shell, thereby enabling the electronic device to resist high overload and to be relatively low in packaging stress.

Description

technical field [0001] The invention relates to packaging of electronic devices, in particular to an electronic device with low stress and high overload resistance and a packaging method thereof. Background technique [0002] Electronic device packaging is to electrically connect one or more electronic device chips to each other, and then encapsulate them in a protective structure to provide electrical connection, mechanical protection, chemical corrosion protection, etc. for the electronic chips. For some sensor products in industrial applications, due to the consideration of performance and reliability, especially the consideration of reducing the impact of stress, the cavity packaging method is often used, that is, the electronic chip is mounted on the bottom plate of the preformed package through adhesive , bonding the metal wires to lead the electrical signal of the chip out of the package shell, and finally sealing the package shell with a cover plate. Some electronic...

AI Technical Summary

Problems solved by technology

However, in this method, the contact area between the electronic chip and the soft glue is large, and the thermal expansion coefficients of the soft glue and the electronic chip differ greatly, so the stress generated by the soft glue will also affect the performance of the electronic chip that is very sensitive to stress; moreover, The surface of the electronic chip is fully or partially covered with soft glue, and some types of electronic chips, such as the sensitive area of ​​the chip surface of high-sensitivity pressure sensors and light sensors, cannot be covered by any objects. Obviously, this method is not suitable for these types of electronic chips

[0006] To sum up, high overload resistance and stress reduction are often a pair of contradictions. The existing electronic device packaging technology cannot guarantee low stress on the electronic chip while achieving high overload resistance performance.

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