Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Solder resisting process for circuit board

A circuit board and solder mask technology, applied in the field of circuit board production technology, can solve problems such as poor solder mask effect, and achieve the effects of good heat resistance, broad market prospects and long service time

Inactive Publication Date: 2018-11-13
赣州中盛隆电子有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the solder mask process of circuit boards has the problem of poor solder mask effect.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A solder resist process for a circuit board, comprising the steps of:

[0030] (1) Pretreatment

[0031] First, the volcanic ash grinding material is pretreated on the circuit board through the grinding roller, the particle size of the volcanic ash grinding material is 15um, the concentration of the volcanic ash is 15%, and the grinding scar width of the grinding roller is 10mm;

[0032] (2) drilling

[0033] Drilling the pretreated circuit board, and copper-plating the hole wall, the thickness of the copper-plating is 30um;

[0034] (3) Coating photosensitive resin

[0035] Coat photosensitive resin on the circuit board after drilling, then form photosensitive dry film by dryer, the thickness of described photosensitive dry film is 45um, and the composition of described photosensitive resin is o-methyl novolac epoxy acrylic resin, horseshoe Maleic anhydride and N,N-dimethylaniline, the proportioning of described o-methyl novolac epoxy acrylic resin and maleic anhydr...

Embodiment 2

[0047] A solder resist process for a circuit board, comprising the steps of:

[0048] (1) Pretreatment

[0049] First, the volcanic ash grinding material is pretreated on the circuit board through the grinding roller, the particle size of the volcanic ash grinding material is 20um, the concentration of the volcanic ash is 18%, and the grinding scar width of the grinding roller is 15mm;

[0050] (2) drilling

[0051] The pretreated circuit board is drilled, and the hole wall is copper-plated, and the thickness of the copper-plating is 35um;

[0052] (3) Coating photosensitive resin

[0053] Coat photosensitive resin on the circuit board after drilling, then form photosensitive dry film by dryer, the thickness of described photosensitive dry film is 50um, and the composition of described photosensitive resin is o-methyl novolac epoxy acrylic resin, horseshoe Maleic anhydride and N,N-dimethylaniline, the proportioning of described o-methyl novolac epoxy acrylic resin and malei...

Embodiment 3

[0065] A solder resist process for a circuit board, comprising the steps of:

[0066] (1) Pretreatment

[0067] First, the volcanic ash grinding material is pretreated on the circuit board through the grinding roller, the particle size of the volcanic ash grinding material is 25um, the concentration of the volcanic ash is 20%, and the grinding scar width of the grinding roller is 20mm;

[0068] (2) drilling

[0069] The pretreated circuit board is drilled, and the hole wall is copper-plated, and the thickness of the copper-plating is 40um;

[0070] (3) Coating photosensitive resin

[0071]Coat photosensitive resin on the circuit board after drilling, then form photosensitive dry film by dryer, the thickness of described photosensitive dry film is 55um, and the composition of described photosensitive resin is o-methyl novolac epoxy acrylic resin, horseshoe Maleic anhydride and N,N-dimethylaniline, the proportioning of the o-methyl novolac epoxy acrylic resin and maleic anhyd...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a solder resisting process for a circuit board. By ingredients and ratio of photosensitive resin, the flexibility of printing ink can be improved obviously, meanwhile, the photosensitive resin has the characteristics of good heat resistance, acid resistance, alkali resistance, solvent resistance and the like, by control over light exposure through an exposure machine, the light exposure can be ensured, inspection is carried out after exposure and development, items of the inspection comprise oil adhesion and hole plugging on the surface of the circuit board, it can be ensured that the produced circuit board meets requirements for circuit boards, segmented baking is two-section baking, it can be ensured that reliability of printing ink can meet the requirement, and the solder resisting process for the circuit board has the advantages that requirements are met, and the service time of the produced circuit board is long, and has wide market prospect.

Description

technical field [0001] The invention relates to the field of circuit board production technology, in particular to a circuit board solder resistance process. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. At present, there is a problem that the solder resisting effect of the circuit board is not good. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a circuit board solder resist process to solve the ab...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28G03F7/004G03F7/027
CPCH05K3/287G03F7/004G03F7/027H05K2203/1105H05K2203/1476
Inventor 揭添增古云生高永忠石磊宋自成
Owner 赣州中盛隆电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com