Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Inner layer pattern design method for improving copper pull during drilling

A technology of inner layer graphics and design method, applied in the direction of electrical connection formation of printing components, etc., can solve the problems of increased cutting resistance of drill bits, scrapped and enlarged boards, etc., to improve the quality of the board, reduce the scrap rate, and ensure reliability. sexual effect

Active Publication Date: 2018-11-06
SHENZHEN SUNTAK MULTILAYER PCB
View PDF6 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the development of precision technology, the ring width of the inner annular ring is required to be smaller and smaller, which will cause the diameter of the part to be drilled in the round copper PAD to be much larger than the width of the annular ring to be retained, which is very easy to drill. Copper pulling occurs, that is, the part of the annular ring that needs to be retained is pulled out, causing the board to be scrapped; and as the copper thickness of the inner layer of the printed circuit board continues to increase, the cutting resistance of the drill bit during drilling will also continue to increase. In this way, the pulling force of the drill bit on the inner layer copper foil will also increase continuously, which further increases the problem of pulling out the inner layer ring during the drilling process.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] This embodiment provides a method for manufacturing a PCB, which includes improving the inner layer graphic design method for drilling and pulling copper. The specific process is as follows:

[0023] (1) Cutting: Cut out the inner core board according to the panel size 520mm×620mm, the thickness of the inner core board is 0.2mm, and the thickness of the outer layer copper foil is 1OZ; according to the design requirements, reserve useful space for the inner core board The position where the hole is drilled after pressing is called the drilling position.

[0024] (2), inner layer circuit production (negative film process): inner layer graphics transfer, use a vertical coating machine to coat a photosensitive film on the inner layer core board, and the film thickness of the photosensitive film is controlled at 8 μm; - 6-grid exposure ruler (21-grid exposure ruler) completes the inner layer circuit exposure on the inner core board, transfers the inner layer graphics on the ...

Embodiment 2

[0040]This embodiment provides a method for manufacturing a PCB, especially a method for preventing copper from being pulled when drilling; the manufacturing steps of this embodiment are basically the same as those of Embodiment 1, except that steps (1) and (2) ), specifically as follows: when the thickness of the outer layer copper foil on the inner layer core plate in step (1) is less than 1OZ; the outer diameter of the ring figure in the corresponding step (2) is 0.4mm larger than the diameter of the drilled hole position.

[0041] According to the method of Example 2, 1000 PCBs were repeatedly produced, and no PCB had the problem of copper pulling when drilling holes.

Embodiment 3

[0043] This embodiment provides a method for manufacturing a PCB, especially a method for preventing copper from being pulled when drilling; the manufacturing steps of this embodiment are basically the same as those of Embodiment 1, except that steps (1) and (2) ), specifically as follows: when the thickness of the outer layer copper foil on the inner layer core plate in step (1) is greater than 2OZ; the outer diameter of the ring figure in the corresponding step (2) is 0.6mm larger than the diameter of the drilled hole.

[0044] According to the method of Example 3, 1000 PCBs were repeatedly produced, and no PCB had the problem of copper pulling when drilling holes.

[0045] In other embodiments of the present invention, according to the allowable maximum drilling deviation d / 2mm in the actual production process, the inner diameter of the ring figure is designed to be dmm smaller than the drilling position on one side (i.e. the maximum drilling deviation Twice of that); For e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an inner layer pattern design method for improving copper pull during drilling. The method comprises the following steps: setting a drilling location on an inner layer core board, wherein the drilling location is a location that needs to be drilled in subsequent processing; transferring an inner layer pattern on a film to the inner core board by a negative film process, wherein the inner layer pattern comprises a circular ring pattern having an outer diameter larger than the diameter of the drilling location, and the inner diameter of the circular ring pattern is less than the diameter of the drilling location; and removing exposed copper on the inner core board by etching, and then removing the film to form an inner layer circuit via the inner layer pattern and toform a circular ring via the circular ring pattern. By adoption of the method disclosed by the invention, the cutting resistance of a drill bit in the subsequent drilling and the pulling force of thedrill bit to the inner layer copper foil, thereby reducing the copper pull during drilling, effectively reducing the scrap rate of the board and improving the quality of the board.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to an inner layer graphic design method for improving drilling and pulling copper. Background technique [0002] In order to achieve the purpose of connecting different layers of circuits in the printed circuit board, it is necessary to design the inner layer annular ring at the drilling position in advance before the printed circuit board is pressed. The current design method of the inner layer annular ring first drills the corresponding holes in the inner layer circuit Make a round copper PAD at the position, and the diameter of the round copper PAD is the sum of the diameter of the drill hole and the ring width of the inner ring ring twice the design requirement. After pressing, remove the copper drill in the middle of the round copper PAD by drilling to form an inner ring. Layer hole ring, and then copper plating in the hole is connected with the hole ri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K3/42
Inventor 莫崇慧彭卫红莫崇明孙保玉
Owner SHENZHEN SUNTAK MULTILAYER PCB
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com