Method for improving bonding strength of metal-organic decomposition silver ink

A technology of metal organics and bonding strength, applied in the direction of copying/marking methods, printing, etc., can solve the problems of increasing the time and cost required for the process, the deterioration of the conductivity of the silver film, and the complexity of the theory and principle, so as to reduce the cost of time and materials , Improve the bonding strength, increase the effect of the contact area

Inactive Publication Date: 2018-11-02
SOUTH CHINA UNIV OF TECH
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  • Claims
  • Application Information

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Problems solved by technology

However, the implementation process of these methods is relatively cumbersome, the theory and principle are very complicated, which increases the time and cost required for the process, and adding too many additives will obviously deteriorate the conductivity of the silver film.

Method used

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  • Method for improving bonding strength of metal-organic decomposition silver ink
  • Method for improving bonding strength of metal-organic decomposition silver ink

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Experimental program
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Embodiment

[0028] (1) Wash the glass substrate with isopropanol, tetrahydrofuran, alkaline cleaning solution, deionized water for the first time, deionized water for the second time, and isopropanol, each step of which is shaken with an ultrasonic cleaner for 5-10 minutes . Then put the cleaned substrate into an oven and dry at 80-85°C.

[0029] (2) The printer (Dimatix DMP-2800 printer) uses TEC-IJ-010MOD solution silver ink (purchased from Korea InkTec; solid content is 15%, viscosity is 9-15 cps, surface tension is 30-32 dynes / cm, The solvent used is ethanol, the recommended sintering temperature is 130℃~150℃, and the reference resistivity is 4.2μΩ·cm) Print preset patterns on the substrate after cleaning and drying in step (1), and the printing parameters are set as: nozzle The distance between the substrate and the substrate is 1000 μm, the distance between the ink drops is 40 μm, the substrate temperature is 50-55°C, and the nozzle temperature is 50-55°C.

[0030] (3) The substrate af...

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Abstract

The invention belongs to the technical field of photoelectric materials and discloses a method for improving the bonding strength of metal-organic decomposition silver ink. The method comprises the following steps of conducting ultrasonic cleaning and drying on a substrate; printing a preset pattern on the substrate through MOD silver sink by selecting the 40-micron ink droplet spacing thorough anink-jet printing method under the indoor temperature to form a liquid-state silver film; conducting heat curing on the liquid-state silver film at 200 DEG C for 20 min to obtain a silver conductive film. The bonding strength of the silver film formed by the MOD silver ink and the glass substrate is improved under the condition of not changing ink components by adjusting the ink droplet spacing ofink-jet printing and the specific heat curing temperature. Through the method, there is no need to change the formula of the silver ink and adjust the nature of the silver ink. The method is simple and easy to implement, and the time and material cost are reduced.

Description

Technical field [0001] The invention belongs to the technical field of optoelectronic materials, and specifically relates to a method for improving the bonding strength of a metal organic matter decomposition type silver ink. Background technique [0002] Metal-Organic decomposition silver ink (MODsilver ink) is a kind of silver ink widely used in the preparation of conductive films. It mainly produces silver nanoparticles through the decomposition reaction of silver compounds, thereby forming conductive Silver film. [0003] Since the MOD type silver ink is mainly composed of a silver compound and an organic solvent, the silver compound decomposes to produce metallic silver nanoparticles after curing, thereby forming a silver film. The violent volatilization of organic solvents during thermal curing will cause a large number of bubbles to be discharged from the bottom to the surface. When the thickness of the liquid film is large, the bubbles need to travel a long distance to re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41M5/00
Inventor 宁洪龙周艺聪姚日晖陶瑞强陈建秋杨财桂蔡炜刘贤哲朱镇南彭俊彪
Owner SOUTH CHINA UNIV OF TECH
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