Fluorine-containing resin-based copper-clad plate with high dielectric constant and preparation method of plate

Abstract

The invention belongs to the field of communication materials, and particularly relates to a fluorine-containing resin-based copper-clad plate with a high dielectric constant and a preparation methodof the plate. According to the plate, surfaces of inorganic fillers are collectively modified by coupling agents and parts of fluorine-containing polymers, so that interaction force among the inorganic fillers and fluorine-containing resin substrates are higher, the loading amount of the inorganic fillers in the fluorine-containing resin substrates is high (>=50wt%), the compatibility among the inorganic fillers and the substrates is good, the bonding power among the inorganic fillers and the substrates is high, dispersion performances among the inorganic fillers and the substrates are better,so that a prepared fluorine-containing resin-based dielectric slice is uniform and good in dielectric property, the dielectric constant is larger than or equal to 5.0, and dielectric loss is only smaller than or equal to 0.002. The fluorine-containing resin-based copper-clad plate has a certain mechanical strength, excellent heat stability and high copper foil peel strength and can meet various performance requirements for diversified and complicated functions of the copper-clad plates and high-density and multilayer circuit arrangement and the like in the field of high-frequency and high-speed communication.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a fluorine-containing resin-based high-frequency copper-clad laminate with high dielectric constant and a preparation method thereof. Background technique [0002] Copper clad laminates are widely used in mobile phones, computers, vending machines, communication base stations, satellites, wearable devices, unmanned vehicles, drones and intelligent robots, and are one of the key basic materials for the electronic communication and information industries. The fluorine-containing resin represented by polytetrafluoroethylene (PTFE) has many excellent properties such as low dielectric constant, low dielectric loss, high thermal stability and chemical stability that cannot be compared with other polymer resins. It is an ideal Copper clad laminate base material. Since the US patent US3136680 first reported the PTFE-based copper clad laminate and its manufacturing meth...

AI Technical Summary

Problems solved by technology

In addition, the interaction between the alkane chain at one end of the commonly used coupling agent and the fluorine-containing polymer chain is also weak.

In other words, if the surface of the inorganic filler is only modified with a coupling agent, the degree of improvement in the compatibility between it and the fluorine-containing resin matrix is ​​also limited.

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