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Chemical grinding and polishing fluid, and grinding and polishing method

A technology of chemical grinding and polishing liquid, which is applied in the field of metal surface treatment, can solve the problems of environmental pollution, high toxicity of chemical grinding and polishing liquid, etc., and achieve the effect of reducing energy consumption

Active Publication Date: 2018-10-09
浙江瑞特良微电子材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a chemical grinding and polishing liquid, which can solve the problems of high toxicity and environmental pollution in the chemical grinding and polishing liquid in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A chemical grinding and polishing liquid is composed of the following raw materials: 10 grams of sulfuric acid (98%), 250 grams of hydrogen peroxide (50%), 80 grams of ethanol, 3 grams of triethanolamine, 25 grams of sodium acetate, and 632 grams of deionized water.

[0032] The preparation method is as follows:

[0033] Weigh 10 grams of sulfuric acid solution (98%), 250 grams of hydrogen peroxide solution (50%), 80 grams of ethanol, 3 grams of triethanolamine, 25 grams of sodium acetate, and 632 grams of deionized water. Put deionized water in a beaker with a volume of 2L, slowly inject sulfuric acid into the beaker under stirring conditions, continue to inject hydrogen peroxide, ethanol, triethanolamine and sodium acetate into the beaker, and stir evenly to obtain chemical polishing and grinding liquid.

[0034] Grinding and polishing experiment:

[0035] Take the corroded copper sheet for chemical grinding and polishing

[0036] Step 1: Degreasing; place the copp...

Embodiment 2

[0044] A chemical grinding and polishing liquid is composed of the following raw materials: 150 grams of sulfuric acid (98%), 100 grams of hydrogen peroxide (50%), 80 grams of ethanol, 25 grams of triethanolamine, 25 grams of sodium acetate, and 620 grams of deionized water.

[0045] The preparation method is as follows:

[0046] Weigh 150 grams of sulfuric acid, 100 grams of hydrogen peroxide, 80 grams of ethanol, 25 grams of triethanolamine, 25 grams of sodium acetate, and 620 grams of deionized water, put the deionized water in a beaker with a volume of 2 L, and slowly Inject sulfuric acid into the beaker, continue to inject hydrogen peroxide, ethanol, triethanolamine, and sodium acetate into the beaker, and stir evenly to obtain a chemical polishing solution.

[0047] Grinding and polishing experiment:

[0048] Take the corroded copper sheet for chemical grinding and polishing

[0049] Step 1: Degreasing; place the copper sheet in a degreasing agent (Shanghai Ruiteliang ...

Embodiment 3

[0057] A chemical grinding and polishing liquid, which is composed of the following raw materials: 120 grams of sulfuric acid (98%), 500 grams of hydrogen peroxide (50%), 30 grams of ethanol, 15 grams of triethanolamine, 30 grams of sodium acetate, and 305 grams of deionized water.

[0058] The preparation method is as follows:

[0059] Weigh 120 grams of sulfuric acid, 500 grams of hydrogen peroxide, 30 grams of ethanol, 15 grams of triethanolamine, 30 grams of sodium acetate, and 305 grams of deionized water, place the deionized water in a beaker with a volume of 2 L, and slowly Pour sulfuric acid into the beaker, continue to pour hydrogen peroxide, ethanol, triethanolamine, and sodium acetate into the beaker, and stir evenly to obtain the chemical polishing solution.

[0060] Grinding and polishing experiment:

[0061] Take the corroded copper sheet for chemical grinding and polishing

[0062] Step 1: Degreasing; place the copper sheet in a degreasing agent (Shanghai Ruit...

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PUM

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Abstract

The invention discloses chemical grinding and polishing fluid which comprises the following components: 1-15 percent by weight of sulfuric acid solution, 10-50 percent by weight of hydrogen peroxide solution, 3-15 percent by weight of stabilizing agent, 0.1-5 percent by weight of wetting agent and 2-12 percent by weight of leveling agent. Compared with the prior art, the chemical grinding and polishing fluid disclosed by the invention does not contain nitric acid, chromic anhydride and other toxic and harmful substances and cannot harm the human body health and cause the pollution to an environment in the grinding and polishing processes; the grinding and polishing processes are performed at a normal temperature without heating, so that the energy consumption of chemical reaction is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of metal surface treatment, in particular to a chemical grinding and polishing liquid. Background technique [0002] Copper and its alloys are widely used in electronics, machinery, communication, decoration and other fields due to their excellent electrical conductivity, corrosion resistance and beautiful luster. However, when copper products are exposed to the atmosphere and humid environment for a long time, they will be corroded and lose their luster, which will affect their use value. Therefore, before using copper and alloys, they must be surface treated to maintain their original luster. Chemical grinding and polishing is widely used as a metal surface treatment technology. The bright surface obtained by chemical grinding improves the decorative effect and surface performance of copper and its alloys, thereby increasing its use value. However, for a long time, most domestic manufacturers have used ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/06C23F3/03
CPCC09G1/06C23F3/03
Inventor 何友余吴育祥李德荣
Owner 浙江瑞特良微电子材料有限公司
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