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Lead-free sealing glass, sealing device and production method of lead-free sealing glass

A manufacturing method and glass technology, applied in glass manufacturing equipment, glass molding, glass reshaping, etc., can solve problems such as large expansion coefficient of lead-free sealing glass, lead containing, and reduced packaging effect

Pending Publication Date: 2018-10-02
BEIJNG ASAHI ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Prior to this, the sealing glass used in large quantities was lead-zinc (PbO-ZnO) low-melting sealing glass. Although this glass can already meet the sealing requirements of vacuum glass devices, due to the Contains lead, which is harmful to the environment and human health
[0003] In addition, although the existing technology can also realize the production of lead-free sealing glass, the expansion coefficient of the lead-free sealing glass obtained is generally large, and the large expansion coefficient is difficult to match with the expansion coefficient of the sealed body. , will form cracks or gaps at the sealing, reducing the packaging effect, therefore, the manufacture of lead-free and low expansion coefficient sealing glass has become a problem that must be solved as soon as possible

Method used

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  • Lead-free sealing glass, sealing device and production method of lead-free sealing glass

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Effect test

Embodiment 1

[0055] In specific implementation, in order to obtain lead-free sealing glass with lower softening temperature and lower expansion coefficient, the composition of lead-free sealing glass can include bismuth oxide, vanadium oxide, tungsten oxide, tellurium oxide, zinc oxide , and boron oxide, and a ceramic filler made of aluminum titanate is added therein. Wherein, the weight percentage of bismuth oxide can be 20%-25%, the weight percentage of vanadium oxide can be 25%-30%, the weight percentage of tungsten oxide can be 15%-20%, and the weight percentage of tellurium oxide can be 15% -20%, the weight percentage of zinc oxide can be 10%-15%, the weight percentage of boron oxide can be 1%-5%, wherein the weight percentage of aluminum titanate is 30%-50% of the total weight. More specifically, corresponding to the first type in Table 1, an expansion coefficient of 49×10 is provided －7 / ° C, softening temperature is 345 ° C, sealing temperature is 480 ° C to 520 ° C glass frit. ...

Embodiment 2

[0065] In specific implementation, in order to obtain lead-free sealing glass with lower softening temperature and better chemical stability, the composition of lead-free sealing glass can include bismuth oxide, vanadium oxide, tungsten oxide, tellurium oxide, Zinc oxide and boron oxide, and a ceramic filler made of eucryptite is added thereto. Wherein, the weight percentage of bismuth oxide is 25%-30%, the weight percentage of vanadium oxide is 20%-25%, the weight percentage of tungsten oxide is 10%-15%, and the weight percentage of tellurium oxide is 20%-25%, The weight percentage of zinc oxide is 5%-10%, the weight percentage of boron oxide is 5%-10%, and the weight percentage of eucryptite is 20%-40% of the total weight. More specifically, corresponding to the second type in Table 1, an expansion coefficient of 65×10 is provided －7 / ° C, glass powder with a softening temperature of 365 ° C.

[0066] The composition of the glass powder is as follows:

[0067]

[0068...

Embodiment 3

[0075] In specific implementation, in order to obtain a lead-free sealing glass with high chemical stability, the composition of the lead-free sealing glass can include bismuth oxide, vanadium oxide, tungsten oxide, tellurium oxide, zinc oxide and boron oxide, A ceramic filler made of cordierite is added therein. Wherein, the weight percentage of bismuth oxide is 18%-23%, the weight percentage of vanadium oxide is 20%-25%, the weight percentage of tungsten oxide is 20%-25%, and the weight percentage of tellurium oxide is 18%-22%, The weight percentage of zinc oxide is 15%-20%, the weight percentage of boron oxide is 1%-5%, and the weight percentage of cordierite is 30%-50% of the total weight. More specifically, corresponding to the third type in Table 1, an expansion coefficient of 61×10 is provided －7 / °C, glass powder with a softening temperature of 352°C.

[0076] The composition of the glass powder is as follows:

[0077]

[0078]

[0079] In manufacturing, the a...

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Abstract

The invention discloses lead-free sealing glass, a sealing device and a production method of the lead-free sealing glass and aims to provide sealing glass which contains no lead and has lower expansion coefficient. The lead-free sealing glass is at least prepared from, in percentage by weight, 15%-60% of bismuth oxide, 10%-30% of vanadium oxide, 5%-30% of tungsten oxide, 5%-30% of tellurium oxide,5%-30% of zinc oxide and 1%-10% of boron oxide through mixing and melting.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a lead-free sealing glass, a packaging device and a manufacturing method thereof. Background technique [0002] In the production process of vacuum glass products, glass or glass frit with lower melting point and lower expansion coefficient is usually required as a sealing material. Prior to this, the sealing glass used in large quantities was lead-zinc (PbO-ZnO) low-melting sealing glass. Although this glass can already meet the sealing requirements of vacuum glass devices, due to the Contains lead, which is harmful to the environment and human health. [0003] In addition, although the existing technology can also realize the production of lead-free sealing glass, the expansion coefficient of the lead-free sealing glass obtained is generally large, and the large expansion coefficient is difficult to match with the expansion coefficient of the sealed body. , will form c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/24C03B23/207
CPCC03B23/207C03C8/24
Inventor 秦国斌卢克军于洪林
Owner BEIJNG ASAHI ELECTRONICS MATERIAL CO LTD
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