Radiator for directly cooling chip through fluorine and use method thereof

Abstract

The invention discloses a radiator for directly cooling a chip through fluorine and a use method thereof. The radiator comprises a heat exchanger, wherein the bottom of the heat exchanger is contactedand connected with the chip, an exit pipe is arranged at the upper part of the heat exchanger, and a pressure sensor and a gas flow sensor are arranged on the exit pipe; a liquid inlet pipe is arranged at the bottom of the sidewall of the heat exchanger, and a liquid flow sensor is arranged on the liquid inlet pipe; multilayer of grating plates are arranged at the middle part of the heat exchanger; a gas collecting cavity is arranged above the grating plates, and a cooling liquid cavity is formed below the grating plates; the heat exchanger is connected with a condenser through the exit pipe,a liquid outlet of the condenser is connected with a liquid storage tank through a pipeline, and the liquid storage tank is connected with a regulating pump through the pipeline; and the liquid outlet of the regulating pump is connected with the heat exchanger through the liquid inlet pipe. The efficiency of the radiator is improved by using phase-change heat transfer of fluorinated liquid, the real-time state can be detected, the radiating efficiency can be regulated, and the leakage point can be accurately detected, and the stable operation of a radiating system is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of chip cooling devices, and in particular relates to a direct fluorine cooling chip radiator and a using method thereof. Background technique [0002] With the development of science and technology, the power density of electronic information equipment in the data center is constantly increasing, and the power consumption of the new generation of CPU, GPU and other chips is increasing, which puts forward higher requirements for the heat dissipation of the existing data center. Require. Liquid cooling is a new technology for data centers to cope with the development of high power density. Water or fluorinated liquid is often used to take away the heat generated by chips. Currently, common liquid cooling radiators include liquid cooling plates (water cooling plates), heat pipes, etc. [0003] The retrieved publication number is CN201510970405.2, which mentions a liquid-cooled plate radiator, which uses the t...

AI Technical Summary

Problems solved by technology

The heat pipe is a heat exchanger with high heat exchange efficiency. The fluorinated liquid filled in it can evaporate and absorb heat at the heating element end, and then condense and release heat at the cooling end. However, due to the limitation of the heat pipe processing technology, the size is small. Multiple heat pipes are required to work together, and the heat conduction power limits heat pipes from being used in higher density cabinets

In addition, the heat pipe is limited by the driving force and cannot conduct long-distance heat transfer, which limits the heat dissipation power and heat dissipation efficiency of the heat pipe radiator

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