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Yellow-light LED packaging structure and packaging method

A technology of LED packaging and LED chips, which is applied in the direction of electric light sources, lighting devices, and components of lighting devices, can solve the problems of low luminous efficiency of yellow LEDs, solve the problems of water and oxygen isolation and heat insulation, reduce costs, The effect of improving stability

Inactive Publication Date: 2018-09-18
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a yellow light LED packaging structure and packaging method, which can effectively solve the technical problem of low luminous efficiency of the existing yellow light LED

Method used

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  • Yellow-light LED packaging structure and packaging method
  • Yellow-light LED packaging structure and packaging method

Examples

Experimental program
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Effect test

Embodiment 1

[0049] First, mix the two-component heat-insulating silica gel evenly according to the mass ratio of 1:1, then place it in a vacuum drying oven at room temperature to defoam until there are no bubbles, and then evenly inject it into the polymer base with the blue LED chip fixed until the chip is submerged 1mm; then cured at constant temperature in a vacuum drying oven, pre-cured at 60°C for 1 hour, and continued to cure at 160°C for 2 hours. Under the action of surface tension, the silica gel naturally forms a bowl structure. Then quantum dots are synthesized, using cesium stearate, oleic acid, oleylamine, PbI 2 and PbBr 2 Synthesis of yellow light perovskite quantum dots CsPb(Br x I 1-x ) 3 , where x=0.60, such as image 3 As shown, among them, image 3 (a) is the TEM image of the yellow light perovskite quantum dots, image 3 (b) is an enlarged view of the yellow light perovskite quantum dot transmission electron microscope, image 3 (c) is the energy dispersive x-ray...

Embodiment 2

[0051] First, mix the two-component heat-insulating silica gel evenly according to the mass ratio of 1:1, then place it in a vacuum drying oven at room temperature to defoam until there are no bubbles, and then evenly inject it into the polymer base with the blue LED chip fixed until the chip is submerged 1mm; then cured at constant temperature in a vacuum drying oven, pre-cured at 60°C for 1 hour, and continued to cure at 140°C for 3 hours. Under the action of surface tension, the silica gel naturally forms a bowl structure. Then quantum dots are synthesized, using cesium stearate, oleic acid, oleylamine, PbI 2 and PbBr 2 Synthesis of yellow light perovskite quantum dots CsPb(Br x I 1-x ) 3 , where x=0.65, the synthesized quantum dots were centrifuged, using cyclohexane as the solvent, the solid-liquid ratio was 1:1 (ml / mg), injected into the surface of the cured silica gel after ultrasonic dispersion for 10s, and then vacuum Stand in a dry box at 35°C for 1 hour. After ...

Embodiment 3

[0053] First, mix the two-component heat-insulating silica gel evenly according to the mass ratio of 1:1, then place it in a vacuum drying oven at room temperature to defoam until there are no bubbles, and then evenly inject it into the polymer base with the blue LED chip fixed until the chip is submerged 1mm; then cured at constant temperature in a vacuum drying oven, pre-cured at 60°C for 1 hour, and continued to cure at 140°C for 3 hours. Under the action of surface tension, the silica gel naturally forms a bowl structure. Then quantum dots are synthesized, using cesium stearate, oleic acid, oleylamine, PbI 2 and PbBr 2 Synthesis of yellow light perovskite quantum dots CsPb(Br x I 1-x ) 3 , where x=0.62, the synthesized quantum dots were centrifuged, using cyclohexane as the solvent, the solid-to-liquid ratio was 1:2 (ml / mg), injected into the surface of the cured silica gel after ultrasonic dispersion for 10s, and then vacuum Stand in a dry box at 30° C. for 1 hour. A...

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Abstract

The invention discloses a yellow-light LED packaging structure and a packaging method. The yellow-light LED packaging structure comprises a blue-light LED chip, a polymer foundation, an electrode wire, thermal insulating silica gel layers, yellow-light perovskite quantum dot layers, protective layers and polysiloxane packaging layers, wherein the polymer foundation is used for fixing the blue-light LED chip and comprises a base and fences arranged around the base, and the blue-light LED chip is fixed on the base; the electrode wire is connected with the blue-light LED chip and the polymer foundation; the thermal insulating silica gel layers are cured around the blue-light LED chip and on the upper surface of the blue-light LED chip; the yellow-light perovskite quantum dot layers are curedon the surfaces of the thermal insulating silica gel layers; the protective layers deposited on the surfaces of the yellow-light perovskite quantum dot layers; and the polysiloxane packaging layers are arranged on the surfaces of the protective layers. Thus, high-stability half-peak width and narrow yellow-light perovskite type quantum dot LED is obtained.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a yellow light LED packaging structure and packaging method. Background technique [0002] LED (Light Emitting Diode, light-emitting diode) has high integrability, can be integrated in various standardized modules, realizes intelligent control, helps energy saving and environmental protection, enhances visual effects, improves light comfort, and is widely used For indoor decorative lighting, traffic lights, car lights, displays, etc., [0003] Traditional yellow light LEDs are mostly directly packaged on chips with a wavelength of 580-595nm (nano) band, but yellow light chips generally have low luminous efficiency and high cost. Of course, there are also other methods of packaging yellow LED chips, such as a yellow LED light source assembly disclosed in Chinese patent CN201210004373.7, which coats yellow phosphor and orange phosphor on the LED chip to achieve yellow light...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V9/40H01L33/48
CPCF21S2/00F21V9/40H01L33/48
Inventor 刘虎王立章少华何沅丹孙沁瑶姚勇
Owner NANCHANG UNIV
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