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High heat dissipation coating for outer shell of electronic device

An electronic device, high heat dissipation technology, applied in the direction of coating, etc., can solve the problems of high cost and the heat dissipation performance of heat dissipation coating can not be significantly improved, and achieve high economic value, excellent heat conduction and heat dissipation performance, and reduce the use cost.

Inactive Publication Date: 2018-09-07
合肥仁德电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among these three materials, metal materials have the best heat dissipation performance, but the cost of metal materials with good heat dissipation performance such as copper and silver is also relatively high, which is not suitable for a large amount of use in heat dissipation coatings, which leads to long-term heat dissipation performance of heat dissipation coatings. can not be significantly improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A high heat dissipation coating for an electronic device shell, the coating contains the following components in parts by mass: 9 parts of silver-plated glass microspheres, 6 parts of spinel, 2 parts of graphite powder, 1 part of carbon nanotubes, epoxy resin 10 parts, 4 parts of methyl methacrylate, 2 parts of glycerol, 0.5 parts of stabilizer.

[0023] In this example, the preparation method of silver-coated glass microspheres is as follows: grinding waste glass into glass micropowder with a particle size of 10 μm, sending the sieved glass micropowder into a bead forming furnace for spheroidization treatment, and obtaining glass micropowder after spheroidization Microbeads, use hydrofluoric acid to roughen the surface of glass microbeads, send the roughened glass microbeads into the sensitization solution composed of stannous chloride and hydrochloric acid solution, sensitize for 15 minutes, and then sensitize The treated glass beads are sent into the copper plating s...

Embodiment 2

[0033] A high heat dissipation coating for an electronic device casing, the coating contains the following components in parts by mass: 12 parts of silver-plated glass microspheres, 10 parts of spinel, 3 parts of graphite powder, 2 parts of carbon nanotubes, epoxy resin 14 parts, 9 parts of methyl methacrylate, 4 parts of glycerol, 1 part of stabilizer.

[0034] In this example, the preparation method of silver-coated glass microspheres is as follows: grinding waste glass into glass micropowder with a particle size of 15 μm, sending the sieved glass micropowder into a bead forming furnace for spheroidization, and obtaining glass micropowder after spheroidization Microbeads, use hydrofluoric acid to roughen the surface of glass microbeads, send the roughened glass microbeads into the sensitization solution composed of stannous chloride and hydrochloric acid solution, sensitize for 30min, and then sensitize The treated glass beads are sent into the copper plating solution, and t...

Embodiment 3

[0044] A high heat dissipation coating for an electronic device shell, the coating contains the following components in parts by mass: 10 parts of silver-plated glass microspheres, 8 parts of spinel, 2.5 parts of graphite powder, 1.5 parts of carbon nanotubes, epoxy resin 12 parts, 7 parts of methyl methacrylate, 3 parts of glycerol, 0.7 parts of stabilizer.

[0045] In this example, the preparation method of silver-coated glass microspheres is as follows: grinding waste glass into glass micropowder with a particle size of 13 μm, sending the sieved glass micropowder into a bead forming furnace for spheroidization, and obtaining glass micropowder after spheroidization For microbeads, use hydrofluoric acid to roughen the surface of glass microbeads, send the roughened glass microbeads into the sensitization solution composed of stannous chloride and hydrochloric acid solution, sensitize for 18 minutes, and then sensitize The treated glass beads are sent into the copper plating s...

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Abstract

The invention relates to the technical field of coating, and in particular, relates to a high heat dissipation coating for an outer shell of an electronic device. The heat dissipation coating containsthe following components: silver-plated glass micro-beads, spinel, a graphite powder, nano carbon tubes, epoxy resin, methyl methacrylate, glycerol, and a stabilizer. The silver-plated glass microspheres are prepared by spheroidizing, coarsening, sensitizing, copper plating and replacement silver plating of a sodium calcium silicate micro-powder. The waste glass is selected from sodium calcium silicate glass; spinel is selected from one of aluminum spinel, zinc spinel, manganese spinel and chrome spinel; the stabilizer is industrial gelatin; the base material selected in the heat dissipationcoating has excellent thermal conductivity, the heat dissipation performance of the coating can be significantly improved, and the use cost of precious metals in the coating can be reduced.

Description

technical field [0001] The invention relates to the technical field of coatings, in particular to a high heat dissipation coating for electronic equipment shells. Background technique [0002] During the use of electronic products, a large amount of heat will be generated. If the heat cannot be dissipated quickly, it will cause local overheating of the equipment, reduce the working performance of electronic products, and seriously affect the service life of electronic products. In order to improve the performance of the product, most electronic products will consider heat dissipation at the beginning of design. At present, the main heat dissipation methods used include air cooling and liquid cooling. These two technical means need to occupy a large space and are generally used for large Inside the equipment, and for some small components and equipment casings, the usual heat dissipation means are to install metal heat dissipation fins or apply heat dissipation paint. [000...

Claims

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Application Information

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IPC IPC(8): C09D4/02C09D4/06C09D7/62C09D7/61
CPCC09D4/06C09D7/61C09D7/62
Inventor 李阳
Owner 合肥仁德电子科技有限公司
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