Laser direct writing pre-forming photocatalysis plating preparing method for material surface metal pattern

Abstract

The invention discloses a laser direct writing pre-forming photocatalysis plating preparing method for a material surface metal pattern, and belongs to the technical field of material surface treatment. The laser direct writing technology and the photocatalysis plating technology are combined, and on the basis of a laser direct writing etched pre-formed high-precision nano semiconductor film pattern, photocatalysis plating is conducted for preparing the high-quality metal pattern. The laser direct writing pre-forming photocatalysis plating preparing method for the material surface metal pattern is environment-friendly, short in process, capable of saving metal, efficient and low in cost and has universality and high stability; and the prepared metal pattern is high in size precision, goodin clad layer surface quality and excellent in performance, and the bonding strength between the prepared metal pattern and a base body is high.

Description

technical field [0001] The invention relates to the technical field of material surface treatment, and in particular provides a preparation method of laser direct writing preformed photocatalytic plating of metal patterns on the material surface. Background technique [0002] Surface metallized materials (such as printed circuit boards, surface metallized semiconductor chips, end-face metallized vacuum tubes, solar cells, metallized film capacitors, etc.) have excellent comprehensive properties such as electrical conductivity, solderability, insulation, and thermal conductivity. , intelligent transportation, healthcare, aerospace, energy and electricity and daily life and other fields have been widely used. In the actual production of surface metallized materials, it is not only necessary to cover the surface of the base material with a metallized layer, but also to process the metallized layer to prepare metal patterns (such as metal circuits, grid electrodes, etc.). There...

AI Technical Summary

Problems solved by technology

However, there are also some problems in the above-mentioned process of laser positive light / backlight catalytic direct writing metal plating pattern, such as: ① laser as a catalytic light source needs to pass through the plating solution or matrix material to participate in the reaction, and the absorption of the laser by the plating solution or matrix material will be It causes a certain energy loss and reduces the energy utilization rate. At the same time, the laser impact on the surface of the material is easy to cause ablation, difficulty in controlling the pattern accuracy, poor coating uniformity, and reduced bonding strength; It is difficult to make full use of its advantages of high energy density when preparing with a laser with relatively small energy; ③ In the process of forming high-precision patterns, the requirements for the uniformity of the plating solution, the substrate material, and the stability of the laser light source are relatively high, and at the same time, the laser As a catalytic light source, short-wave light or extremely short-wave light is generally required to meet the energy requirements of catalysis, which reduces the general applicability of this method.