Polyamic acid composition to which alicyclic monomers are applied and transparent polyimide film using same

A polyamic acid and polyimide resin technology, applied in the field of polyamic acid composition, can solve the problems of easy bending or twisting, low permeability, high thermal expansion coefficient, and achieve the effect of excellent physical properties and product reliability

Active Publication Date: 2018-08-21
DOOSAN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, polyimide (PI) resins are brown or yellow in color due to the high density of aromatic rings, and have low transmittance in the visible light region, so there is a problem that it is difficult to use in fields requiring transparency
In recent years, colorless and transparent polyimide films have been developed, but in this case, compared with conventional polyimide resins, the coefficient of thermal expansion (CTE) is higher and solvent resistance is lowered
Therefore, when the above-mentioned colorless and transparent polyimide is used as a substrate, an optical coating, or a film, there is a problem that bending or twisting is likely to occur due to a high thermal expansion coefficient.

Method used

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  • Polyamic acid composition to which alicyclic monomers are applied and transparent polyimide film using same
  • Polyamic acid composition to which alicyclic monomers are applied and transparent polyimide film using same
  • Polyamic acid composition to which alicyclic monomers are applied and transparent polyimide film using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0095] 1. Manufacture of transparent polyamic acid composition

[0096] More specifically, after charging 58.504 g (85.0 wt%) of N,N-dimethylacetamide (DMAc) into a 100 ml three-neck round bottom flask, the temperature of the reaction vessel was raised to 50° C., and 2,2’ -bis(trifluoromethyl)-4,4'-diaminobiphenyl (2,2'-TFDB) 3 g (4.3 wt%) and after 30 minutes, bis(4-aminophenyl)sulfone (4, 4'-DDS) 1.551 g (2.3 wt%). Then, the corresponding monomers were stirred for 1 hour to completely dissolve 2,2'-TFDB and 4,4'-DDS. After that, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropanedianhydride (2,2-bis(3,4-dicarboxyphenyl)Hexa fluoropropanedianhydride, 6-FDA) and cyclobutanetetracarboxylic acid di After adding 4.855g (7.1wt%) and 0.919g (1.3wt%) of anhydride (CBDA) successively, it cooled to 30 degreeC and dissolved it. The solid content at this time was 15%, and it stirred for 3 hours after that. After completion of the reaction of the monomer, it was naturally cooled to obtain ...

Embodiment 2

[0100] 1. Manufacture of transparent polyamic acid composition

[0101] According to the same conditions as those mentioned in Example 1 above, after charging 54.114 g (85.0 wt%) of N,N-dimethylacetamide (DMAc) in the round bottom flask, the temperature of the reaction vessel was raised to 50°C, add 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (2,2'-TFDB) 3g (4.7wt%) and after 30 minutes, add bis(4- Aminophenyl)sulfone (4,4'-DDS) 1.551 g (2.4 wt%). Then, the corresponding monomers were stirred for 1 hour to completely dissolve 2,2'-TFDB and 4,4'-DDS. After that, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (2,2-bis(3,4-dicarboxyphenyl)Hexafluoropropane dianhydride, 6-FDA) and cyclobutane tetracarboxylic acid di After adding 3.468g (5.5wt%) and 1.531g (2.4wt%) of anhydride (CBDA) successively, it cooled to 30 degreeC and dissolved it. The solid content at this time was 15%, and it stirred for 3 hours after that. After completion of the reaction of the monomer...

Embodiment 3

[0105] 1. Manufacture of transparent polyamic acid composition

[0106] According to the same conditions as those mentioned in Example 1 above, after charging 44.833 g (85.0 wt%) of N,N-dimethylacetamide (DMAc) in the round bottom flask, the temperature of the reaction vessel was raised to 50°C, add 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (2,2'-TFDB) 3g (5.7wt%) and after 30 minutes, add bis(4- Aminophenyl)sulfone (4,4'-DDS) 0.582g (1.1wt%). Then, the corresponding monomers were stirred for 1 hour to completely dissolve 2,2'-TFDB and 4,4'-DDS. After that, 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (2,2-bis(3,4-dicarboxyphenyl)Hexafluoropropane dianhydride, 6-FDA) and cyclobutane tetracarboxylic acid di After adding 3.641 g (6.9 wt%) and 0.689 g (1.3 wt%) of anhydride (CBDA) successively, it cooled to 30 degreeC and dissolved it. The solid content at this time was 15%, and it stirred for 3 hours after that. After completion of the monomer reaction, it ...

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Abstract

The present invention provides a polyamic acid composition comprising (a) a diamine; (b) a dianhydride containing a fluorinated primary dianhydride and an alicyclic secondary dianhydride; and (c) an organic solvent, wherein the alicyclic second dianhydride is contained in an amount of a range of 10 to 80 mol% based on 100 mol% of the total dianhydride, and a transparent polyimide resin film produced from the polyamic acid composition. Since a polyamic acid composition of the present invention has a high glass transition temperature and a low yellow index, the composition can be applied as a flexible display material.

Description

technical field [0001] The present invention relates to a transparent polyimide resin useful as a flexible display substrate or a protective film and a polyamic acid composition for producing such a transparent polyimide resin. Background technique [0002] Generally speaking, polyimide (polyimide, PI) resin refers to the production of polyamic acid derivatives by polymerizing aromatic dianhydride and aromatic diamine or aromatic diisocyanate solution, and then dehydrating the ring at high temperature. High heat-resistant resin produced by imidization. [0003] As the aromatic dianhydride component used in the production of the polyimide resin, pyromellitic dianhydride (PMDA) or biphenyltetracarboxylic dianhydride (BPDA) or the like is used, and as the above-mentioned aromatic diamine component, mainly di Aminodiphenyl ether (ODA), p-phenylenediamine (p-PDA), methylenediamine (m-MDA), methylenediamine (MDA), bisaminophenylhexafluoropropane (HFDA), etc. . Such polyimide re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08J5/18C08G73/10C08L79/08
Inventor 金善怜金东演吴炫锡安炅日
Owner DOOSAN CORP
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