Low-dielectric-constant halogen-free resin composition and low-flowability prepreg with same

Abstract

The invention discloses a low-dielectric-constant halogen-free resin composition and a low-flowability prepreg with the same. The low-dielectric-constant halogen-free resin composition comprises, by weight, 10-80 parts of epoxy resin, 5-30 parts of phenoxy resin, 10-50 parts of flame retardants, 5-50 parts of curing agents, 0-5 parts of curing accelerators, 10-80 parts of fillers, 5-30 parts of toughening agents and 0-80 parts of additives. The low-dielectric-constant halogen-free resin composition and the low-flowability prepreg have the advantages that the low-dielectric-constant halogen-free resin composition is good in wettability and sufficiently low in dielectric constant and dielectric loss tangent, and the low-flowability prepreg prepared from the low-dielectric-constant halogen-free resin composition is good in heat resistance after being cured, is low in dielectric constant and dielectric loss factor, excellent in flame retardance and good in water resistance, water absorption and cohesiveness.

Description

technical field [0001] The invention belongs to the field of resin materials for printed circuit boards, in particular to a halogen-free low-dielectric resin composition and a low-flow prepreg prepared by using the resin composition. Background technique [0002] In recent years, the rapid development of flexible copper clad laminates has promoted the development of electronic products in the direction of "light, thin, short, and small". In the past, the pure film used in rigid-flex boards was difficult to meet the high heat resistance requirements of rigid-flex boards due to the poor dimensional stability of the material itself and the heat resistance. Therefore, PCB manufacturers are looking for other alternative materials for the connection between rigid boards and flexible boards. Currently, the better alternative material is No-Flow prepreg. [0003] The current existing non-flow glue semi-cured products mostly adopt the resin system with rubber-modified epoxy resin as...

AI Technical Summary

Problems solved by technology

However, the use of a large amount of bisphenol A phenolic resin increases the overall viscosity of the resin glue, resulting in poor wettability of the resin composition to the reinforcing material.

Images