Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Lightweight high-impact-resistance high-modulus multilayer composite board easy in thermal forming and preparation method thereof

A multi-layer composite and composite sheet technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve problems such as tensile impact and other performance gaps, poor forming performance, and increased sheet processing difficulty. , to achieve the effect of good formability and excellent formability

Inactive Publication Date: 2018-08-17
嘉兴领科材料技术有限公司
View PDF6 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These processes can realize the manufacture of non-structural or semi-structural parts of SFT materials (such as automotive engineering plastic parts), while CFT is a new lightweight material with higher performance, but its molding process is limited to thermocompression molding and winding molding , generally used in tubular, rod and planar applications, difficult to apply in parts with complex geometries
[0006] Under the same fiber length, as the content of reinforcing fibers (such as glass fiber or carbon fiber) increases, the strength and flexural modulus of the thermoplastic composite sheet will also increase, but the toughness of the sheet may decrease. The density of the material will be increased
Moreover, as the content of glass fiber and carbon fiber increases, the processing difficulty of the plate increases in hot pressing or blister forming, and the forming accuracy of the curved surface will drop significantly.
This directly leads to the fact that many parts with complex geometries or three-dimensional stretched parts are difficult to prepare with high-fiber content fiber-reinforced thermoplastic composite sheets.
[0007] Therefore, the existing fiber-reinforced composite materials can only focus on a certain aspect of performance. For example, CFT boards are reinforced by continuous fibers, which can achieve high strength and high impact resistance, but their formability is poor.
While the chopped fiber reinforced SFT sheet has good formability, but its mechanical properties are significantly insufficient.
The LFT sheet has suitable formability, but its density is higher than that of the resin system without fiber filling, and the tensile impact resistance and other properties are not small compared with CFT.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lightweight high-impact-resistance high-modulus multilayer composite board easy in thermal forming and preparation method thereof
  • Lightweight high-impact-resistance high-modulus multilayer composite board easy in thermal forming and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Embodiment one: if figure 1 As shown, a light-weight, high-impact, high-modulus fiber-reinforced multi-layer composite sheet that is easy to be thermoformed includes a composite sheet body 1; the composite sheet body 1 is composed of two or more layers of composite layer sheets; The composite plate body 1 includes an outer layer 2 and an inner layer 4; the outer layer 2 and the inner layer 4 are composited into a plate by heating and pressing, the outer layer 2 is a fiber-reinforced thermoplastic composite material layer, and the inner layer 4 is an ultra-high molecular weight polymer Ethylene fiber-reinforced resin layer; inner layer 4 includes two layers of ultra-high molecular weight polyethylene fiber-reinforced resin layer 4-1; outer layer 2 includes two layers of fiber-reinforced thermoplastic composite material 2-1, two layers of fiber-reinforced thermoplastic The composite material layer 2-1 is arranged on the upper and lower ends of the two ultra-high molecular...

Embodiment 2

[0050] Such as figure 2 As shown, a light-weight, high-impact, high-modulus fiber-reinforced multilayer composite sheet that is easy to be thermoformed also includes an intermediate layer 3, and the intermediate layer 3 is located between the outer layer 2 and the inner layer 4. The intermediate layer 3 It is a thermoplastic adhesive film layer; the thermoplastic adhesive film layer is polypropylene-based, EVA-based, vinyl, or thermoplastic polyurethane substrate, and its thickness is 0.1 mm to 1 mm; the middle layer 3 includes two layers of thermoplastic adhesive film layers 3-1, the two thermoplastic adhesive film layers 3-1 are respectively located between the ultra-high molecular weight polyethylene fiber reinforced resin layer 4-1 and the fiber reinforced thermoplastic composite material layer 2-1;

[0051] A method for preparing a light-weight, high-impact, high-modulus fiber-reinforced multilayer composite sheet that is easy to be thermoformed is characterized in that ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a lightweight high-impact-resistance high-modulus multilayer composite board easy in thermal forming. The lightweight high-impact-resistance high-modulus multilayer compositeboard comprises a composite board body, and the composite board body is composited by composite lamination boards of a two-layered or multilayered structure. The lightweight high-impact-resistance high-modulus multilayer composite board has the advantages that a lightweight impact-resistant ultrahigh-molecular-weight polyethylene layer and a fiber reinforced thermoplastic composite material are combined, and the large-size board can be prepared through hot pressing; the composite board has the high strength and high impact resistance of the ultrahigh-molecular-weight polyethylene and the lightweight and high modulus of the rigid fiber reinforced composite material; meanwhile, due to the fact that the used rigid fibers are chopped fibers or long fibers, good forming performance under a heating and pressurizing condition is achieved.

Description

technical field [0001] The invention belongs to the technical field of macromolecular materials, and in particular relates to a light-weight, high-impact, high-modulus fiber-reinforced multilayer composite plate that is easy to be thermoformed and a preparation method thereof. Background technique [0002] Fiber-reinforced thermoplastic composite sheets were originally mainly used in the aerospace field and industrial products with special needs. In recent years, they have been used in civilian fields such as automobiles, sports and leisure, and construction. For example, automotive interior parts such as sun visors and rear luggage partitions, aircraft interiors, exterior body panels for trains, architectural decorations, furniture surface coatings, special packaging box shells, etc. It is characterized by high strength, good toughness, environmental protection and recyclability, and has broad application prospects in industrial and civil fields. [0003] The properties of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/36B32B27/32B32B27/06B32B27/08B32B27/20
CPCB32B27/365B32B27/08B32B27/20B32B27/32
Inventor 王春敏孙亚峰胡延东王永荣
Owner 嘉兴领科材料技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products