Soldering flux for halogen-free spray printing solder paste, and preparation method of soldering flux for halogen-free spray printing solder paste

A technology of flux and halogen, applied in the field of flux for halogen-free spray printing solder paste and its preparation, can solve problems such as plugging and wire drawing, and achieve the effects of high activity, improvement of stability and recovery of viscosity

Inactive Publication Date: 2018-08-17
CHINA-UKRAINE INST OF WELDING GUANGDONG ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This flux has excellent thixotropy and viscosity, which can well solve problems such as plugging, wire drawing, and collapse during solder paste printing.

Method used

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  • Soldering flux for halogen-free spray printing solder paste, and preparation method of soldering flux for halogen-free spray printing solder paste

Examples

Experimental program
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preparation example Construction

[0028] Embodiments of the present invention also provide a preparation method for the halogen-free soldering flux for jet printing solder paste, comprising the following steps:

[0029] After mixing the film-forming agent, thixotropic agent and co-solvent, adding the solvent isopropanol, heating and stirring at a temperature of 100-150°C to obtain the first mixture;

[0030] After the temperature of the first mixture drops to 50-65°C, organic acid activators, halogen-free activity enhancers, copper-dissolving inhibitors, halogen-free surfactants, antioxidants and antibacterial agents are added to the first mixture to obtain the second mixture. mixture;

[0031] The second mixture was stirred until completely dissolved and then cooled to room temperature.

[0032] At the same time, it should be noted that, in this embodiment, the solder paste can be prepared by using the above flux as follows:

[0033] Mix the above prepared flux for halogen-free jet printing solder paste wit...

Embodiment 1

[0042] This embodiment provides a halogen-free soldering flux for jet printing solder paste, which is prepared by the following preparation method:

[0043] S1: After mixing 20% ​​of disproportionated rosin, 20% of maleic rosin, 9% of borate modified hydrogenated castor oil, 7.5% of sorbitol and 7.5% of diethylene glycol ether adding the solvent isopropanol, heating and stirring at a temperature of 100-150° C. to obtain the first mixture;

[0044] S2: After the temperature of the first mixture drops to 50-65°C, add 1.6% succinic acid, 1.2% adipic acid, 0.8% itaconic acid, 0.5% triisopropane Alcoholamine, 0.02% of BTA, 0.02% of BI, 0.1% of OP-10, 0.1% of BYK333, 0.01% of catechol, 0.01% of tert-butyl hydroquinone and 0.01% of BHA were added to the first A second mixture is obtained after the mixture;

[0045] S3: Stir the second mixture until completely dissolved and then cool to room temperature.

[0046] This embodiment also provides a kind of solder paste, which is prepar...

Embodiment 2

[0049] This embodiment provides a halogen-free soldering flux for jet printing solder paste, which is prepared by the following preparation method:

[0050] S1: After mixing 20% ​​of polymerized rosin, 20% of maleic rosin, 8% of borate modified hydrogenated castor oil, 7.5% of sorbitol and 7.5% of diethylene glycol ether adding the solvent isopropanol, heating and stirring at a temperature of 100-150° C. to obtain the first mixture;

[0051] S2: After the temperature of the first mixture drops to 50-65°C, add 1.4% succinic acid, 0.6% malic acid, 1.6% adipic acid, 0.4% itaconic acid, 0.5% triisopropanolamine, 0.02% BTA, 0.02% MBT, 0.1% OP-10, 0.1% BYK333, 0.01% catechol, 0.01% tert-butyl hydroquinone and 0.01% BHT is added to the first mixture to obtain the second mixture;

[0052] S3: Stir the second mixture until completely dissolved and then cool to room temperature.

[0053] This embodiment also provides a kind of solder paste, which is prepared by the following method: ...

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Abstract

The invention discloses a soldering flux for a halogen-free spray printing solder paste, and a preparation method of the soldering flux for the halogen-free spray printing solder paste, and relates tothe technical field of electronic packaging spray printing. The soldering flux for the halogen-free spray printing solder paste is mainly prepared by the following raw materials by percentage composition, 1.0-5.0% of organic acid activating agent, 40.0-50.0% of film-forming agent, 5.0-10.0% of thixotropic agent, 0.2-1.0% of halogen-free activity fortifier, 0.01-0.1% of copper-soluble inhibitor, 0.1-1.0% of halogen-free surface active agent, 5.0-15.0% of cosolvent, 0.01-0.1% of antioxidant, 0.01-0.1% of antibacterial agent, and the balance solvent isopropanol. The soldering flux improves the thixotropy and the viscidity of the solder paste, the problems such as mouth blocking and collapsing of the solder paste in a solder paste spray printing technology are solved, the soldering flux is high in activity, good in wetting effect, low in corrosivity and high in oxidation resistance and antibacterial property, all raw materials do not contain any halogens, and the environmental-protectionrequirement is met.

Description

technical field [0001] The invention relates to the technical field of electronic packaging jet printing, and in particular to a halogen-free flux for jet printing solder paste and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, electronic components are becoming smaller, more diverse, and more densely integrated. At present, the traditional solder paste screen printing technology can no longer fully meet the needs of electronic packaging for high power, high density, miniaturization, and high reliability. , greening and other directions. Fully automatic solder paste printing technology is gradually replacing traditional solder paste screen printing technology, triggering a new round of innovation in the field of electronic packaging. However, since the solder paste printing technology uses a nozzle with a diameter of 0.15 mm for printing, it is necessary to use solder powder with a particle diameter of les...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36B23K35/40
CPCB23K35/3612B23K35/40
Inventor 刘凤美易江龙林雨生易耀勇戴宗倍李琪侯斌万娣
Owner CHINA-UKRAINE INST OF WELDING GUANGDONG ACAD OF SCI
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