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Glue for producing packaging paperboard and production process thereof

A technology for packaging cardboard and production process, applied in the direction of adhesive type, adhesive additive, non-polymer adhesive additive, etc. The effect of energy waste, good bonding performance and strong initial adhesion

Inactive Publication Date: 2018-08-07
重庆合信包装印刷有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For a long time, sodium silicate has been the most commonly used adhesive in the corrugated cardboard manufacturing industry. Due to the high alkali content of sodium silicate, it is highly corrosive to paper, and the produced cardboard is prone to dampness, efflorescence, and "white frost". Deformation, can't really protect the product
In recent years, starch glue has been developed and used in China to replace sodium silicate. However, due to the robbing of starch raw materials by many industrial sectors, starch raw materials are in short supply and the price continues to rise.
Moreover, the cardboard is composed of a variety of fiber molecules. The starch glue penetrates into the fibers from the surface pores of the paper to form root-shaped nails. The backing paper and flute peaks are effectively bonded together by glue nails. The starch adhesive prepared by the raw and cooked glue process is far from being able to meet the needs of high-speed production. The high-strength cardboard has better paper quality and high tightness, and the capillary pores on the surface are blocked. Generally, the glue has poor permeability and is prone to false sticking. Bubbles, degumming and other quality problems, resulting in low productivity and unstable product quality

Method used

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  • Glue for producing packaging paperboard and production process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] This embodiment discloses a glue for packaging cardboard production, including the following raw materials in parts by mass: 478 parts of corn flour, 4 parts of borax, 14 parts of sodium hydroxide, 20 parts of adhesive, 3 parts of stabilizer, 1540 parts of water.

[0025] This embodiment also discloses a production process for producing glue for packaging cardboard, comprising the following steps:

[0026] (1) Prepare the following raw materials in weight percentage: 478 parts of corn flour, 4 parts of borax, 14 parts of sodium hydroxide, 20 parts of binder, 3 parts of stabilizer, 1540 parts of water;

[0027] (2) Add water into the container, then add 6 parts of sodium hydroxide, control the temperature at 36°C, and stir for 2 minutes;

[0028] (3) add corn flour, the addition speed of corn flour is controlled at 0.5 part / s, the process of adding corn flour is constantly stirred; Add the viscosity of the solution in the test container after adding corn flour;

[0029...

Embodiment 2

[0034] This embodiment discloses a glue used in the production of packaging cardboard, including the following raw materials in parts by mass: 490 parts of corn flour, 4.3 parts of borax, 14.2 parts of sodium hydroxide, 21 parts of adhesive, 3.2 parts of stabilizer, water 1580 copies.

[0035] This embodiment also discloses a production process for producing glue for packaging cardboard, comprising the following steps:

[0036] (1) Prepare the following raw materials in weight percentage: 490 parts of corn flour, 4.3 parts of borax, 14.2 parts of sodium hydroxide, 21 parts of binder, 3.2 parts of stabilizer, 1580 parts of water;

[0037] (2) Add water into the container, then add 6.2 parts of sodium hydroxide, control the temperature at 36°C, and stir for 2 minutes;

[0038] (3) Add corn flour, the addition speed of corn flour is controlled at 0.51 part / s, the process of adding corn flour is constantly stirred; Add the viscosity of the solution in the test container after add...

Embodiment 3

[0044] This embodiment discloses a glue used in the production of packaging cardboard, including the following raw materials in parts by mass: 484 parts of corn flour, 4.2 parts of borax, 14 parts of sodium hydroxide, 20 parts of adhesive, 3.2 parts of stabilizer, water 1580 parts, 5 parts of glycerin, 4 parts of organic bentonite, 5.2 parts of frankincense.

[0045] This embodiment also discloses a production process for producing glue for packaging cardboard, comprising the following steps:

[0046] (1) Prepare the following raw materials in weight percentage: 490 parts of corn flour, 4.3 parts of borax, 14.2 parts of sodium hydroxide, 21 parts of binder, 3.2 parts of stabilizer, 1580 parts of water;

[0047] (2) Add water into the container, then add 5.8 parts of sodium hydroxide, control the temperature at 36°C, and stir for 2 minutes;

[0048] (3) Add corn flour, the addition speed of corn flour is controlled at 0.51 part / s, the process of adding corn flour is constantly s...

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Abstract

The invention belongs to the technical field of glue processing and particularly discloses glue for producing a packaging paperboard and a production process thereof. The glue for producing the packaging paperboard is prepared from the following raw materials in parts by mass: 460-480 parts of corn flour, 3.8-4.3 parts of borax, 13.6-14.3 parts of sodium hydroxide, 19.5-21.5 parts of bonding agent, 2.8-3.2 parts of stabilizer and 1,400-1,600 parts of water. The production process comprises the following steps: (1) batching materials; (2) adding water into a container and then adding the sodiumhydroxide; (3) adding the corn flour; (4) adding sodium hydroxide solution; (5) adding the stabilizer; (6) adding the borax; (7) adding the bonding agent. The glue prepared by the technical scheme has certain permeability and stronger bonding property, and the packaging paperboard produced by the glue is high in bonding strength and good in effect.

Description

technical field [0001] The invention belongs to the technical field of glue processing, and in particular relates to a glue used in the production of packaging cardboard and a production process thereof. Background technique [0002] At present, with the development of science and technology, packaging printing and other fields are also developing rapidly, and the use of packaging boxes is also increasing, and during the processing of packaging boxes, it is often necessary to use glue to paste them to prevent them Dispersion occurs. For a long time, sodium silicate has been the most commonly used adhesive in the corrugated cardboard manufacturing industry. Due to the high alkali content of sodium silicate, it is highly corrosive to paper, and the produced cardboard is prone to dampness, efflorescence, and "white frost". Deformation can not really protect the product. In recent years, starch glue has been developed and used in China to replace sodium silicate. However, due ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J103/02C09J11/04C09J11/06
CPCC09J103/02C08K3/22C08K3/346C08K5/053C08K9/04C08K13/06C08K2003/387C09J11/04C09J11/06
Inventor 向成建
Owner 重庆合信包装印刷有限公司
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