Chemical deplating composition of nickel-copper alloy layer for circuit board and deplating method thereof
A nickel-copper alloy and circuit board technology, applied to the stripping composition and the stripping field, can solve the problems of unstable stripping rate, corrosion of the tin layer, etc., and achieve the effect of good effect, avoiding excessive corrosion and improving working environment.
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Embodiment 1
[0032] A kind of PBC / Sn / NiCu structure circuit board is used nickel-copper alloy layer chemical deplating composition, comprises m-nitrobenzene sodium sulfonate 50g / L, cyclohexanediaminetetraacetic acid 10g / L, octyl hydroxamic acid 2g / L, ammonia 5g / L, and water, the pH value is 7.2.
[0033] A method for deplating a nickel-copper alloy layer chemical deplating composition for a circuit board with a PBC / Sn / NiCu structure, comprising the following steps: (1) weighing sodium m-nitrobenzenesulfonate, cyclohexyl Alkane diamine tetraacetic acid and octyl hydroxamic acid were dissolved in water respectively to obtain an aqueous solution, and then ammonia water was added to control the pH value of the stripping solution at 7.2.
[0034] (2) Soak the PBC / Sn / NiCu structural circuit board in the deplating solution prepared in step (1), the soaking temperature is 30°C, and the soaking time is 8 minutes.
[0035] (3) Take out the circuit board described in step (2), ultrasonically clean ...
Embodiment 2
[0039] A kind of PBC / Sn / NiCu structure circuit board is used nickel-copper alloy layer chemical deplating composition, comprises m-nitrobenzene sodium sulfonate 60g / L, cyclohexanediaminetetraacetic acid 20g / L, octyl hydroxamic acid 5g / L, ammonia water 10g / L, N-methylpyrrolidone 1.0 g / L and water, the pH value is 7.3.
[0040] A method for deplating a nickel-copper alloy layer chemical deplating composition for a circuit board with a PBC / Sn / NiCu structure, comprising the following steps: (1) weighing sodium m-nitrobenzenesulfonate, cyclohexyl Alkane diamine tetraacetic acid, octylhydroxamic acid, and N-methylpyrrolidone were dissolved in water respectively to obtain an aqueous solution, and then ammonia water was added to control the pH value of the stripping solution at 7.3.
[0041] (2) Soak the PBC / Sn / NiCu structure circuit board in the deplating solution prepared in step (1), the immersion temperature is 55°C, and the immersion time is 2min.
[0042] (3) Take out the circui...
Embodiment 3
[0046] A kind of PBC / Sn / NiCu structure circuit board is used nickel-copper alloy layer chemical deplating composition, comprises m-nitrobenzene sodium sulfonate 80g / L, cyclohexanediaminetetraacetic acid 15g / L, octyl hydroxamic acid 4g / L, ammonia water 8g / L, N-methylpyrrolidone 1.5 g / L and water, the pH value is 7.5.
[0047] A method for deplating a nickel-copper alloy layer chemical deplating composition for a circuit board with a PBC / Sn / NiCu structure, comprising the following steps: (1) weighing sodium m-nitrobenzenesulfonate, cyclohexyl Alkane diamine tetraacetic acid, octylhydroxamic acid, and N-methylpyrrolidone were dissolved in water respectively to obtain an aqueous solution, and then ammonia water was added to control the pH value of the stripping solution at 7.3.
[0048] (2) Soak the PBC / Sn / NiCu structure circuit board in the deplating solution prepared in step (1), the immersion temperature is 40°C, and the immersion time is 5min.
[0049] (3) Take out the circu...
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