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Chemical deplating composition of nickel-copper alloy layer for circuit board and deplating method thereof

A nickel-copper alloy and circuit board technology, applied to the stripping composition and the stripping field, can solve the problems of unstable stripping rate, corrosion of the tin layer, etc., and achieve the effect of good effect, avoiding excessive corrosion and improving working environment.

Active Publication Date: 2018-08-03
深圳市天熙科技开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the invention is to provide a kind of PBC / Sn / NiCu structure circuit board chemical deplating composition and deplating method of nickel-copper alloy layer, to solve the technical problem of excessive corrosion tin layer of existing deplating composition, solve deplating simultaneously Unstable technical issues

Method used

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  • Chemical deplating composition of nickel-copper alloy layer for circuit board and deplating method thereof
  • Chemical deplating composition of nickel-copper alloy layer for circuit board and deplating method thereof
  • Chemical deplating composition of nickel-copper alloy layer for circuit board and deplating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A kind of PBC / Sn / NiCu structure circuit board is used nickel-copper alloy layer chemical deplating composition, comprises m-nitrobenzene sodium sulfonate 50g / L, cyclohexanediaminetetraacetic acid 10g / L, octyl hydroxamic acid 2g / L, ammonia 5g / L, and water, the pH value is 7.2.

[0033] A method for deplating a nickel-copper alloy layer chemical deplating composition for a circuit board with a PBC / Sn / NiCu structure, comprising the following steps: (1) weighing sodium m-nitrobenzenesulfonate, cyclohexyl Alkane diamine tetraacetic acid and octyl hydroxamic acid were dissolved in water respectively to obtain an aqueous solution, and then ammonia water was added to control the pH value of the stripping solution at 7.2.

[0034] (2) Soak the PBC / Sn / NiCu structural circuit board in the deplating solution prepared in step (1), the soaking temperature is 30°C, and the soaking time is 8 minutes.

[0035] (3) Take out the circuit board described in step (2), ultrasonically clean ...

Embodiment 2

[0039] A kind of PBC / Sn / NiCu structure circuit board is used nickel-copper alloy layer chemical deplating composition, comprises m-nitrobenzene sodium sulfonate 60g / L, cyclohexanediaminetetraacetic acid 20g / L, octyl hydroxamic acid 5g / L, ammonia water 10g / L, N-methylpyrrolidone 1.0 g / L and water, the pH value is 7.3.

[0040] A method for deplating a nickel-copper alloy layer chemical deplating composition for a circuit board with a PBC / Sn / NiCu structure, comprising the following steps: (1) weighing sodium m-nitrobenzenesulfonate, cyclohexyl Alkane diamine tetraacetic acid, octylhydroxamic acid, and N-methylpyrrolidone were dissolved in water respectively to obtain an aqueous solution, and then ammonia water was added to control the pH value of the stripping solution at 7.3.

[0041] (2) Soak the PBC / Sn / NiCu structure circuit board in the deplating solution prepared in step (1), the immersion temperature is 55°C, and the immersion time is 2min.

[0042] (3) Take out the circui...

Embodiment 3

[0046] A kind of PBC / Sn / NiCu structure circuit board is used nickel-copper alloy layer chemical deplating composition, comprises m-nitrobenzene sodium sulfonate 80g / L, cyclohexanediaminetetraacetic acid 15g / L, octyl hydroxamic acid 4g / L, ammonia water 8g / L, N-methylpyrrolidone 1.5 g / L and water, the pH value is 7.5.

[0047] A method for deplating a nickel-copper alloy layer chemical deplating composition for a circuit board with a PBC / Sn / NiCu structure, comprising the following steps: (1) weighing sodium m-nitrobenzenesulfonate, cyclohexyl Alkane diamine tetraacetic acid, octylhydroxamic acid, and N-methylpyrrolidone were dissolved in water respectively to obtain an aqueous solution, and then ammonia water was added to control the pH value of the stripping solution at 7.3.

[0048] (2) Soak the PBC / Sn / NiCu structure circuit board in the deplating solution prepared in step (1), the immersion temperature is 40°C, and the immersion time is 5min.

[0049] (3) Take out the circu...

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Abstract

The invention discloses a chemical deplating composition of a nickel-copper alloy layer for a circuit board and a deplating method thereof. The deplating composition comprises 50-80g / L of sodium 3-nitrobenzene sulfonate, 10-20g / L of cyclohexane-diamine-tetraacetic acid, 2-5g / L of octyl hydroximic acid, 5-10g / L of ammonia water and water, wherein the pH value is 7.2-7.5. The deplating method comprises the following steps: (1) successively dissolving the component sin water to obtain an aqueous solution, then adding ammonia water, and controlling the pH value of a deplating solution at 7.2-7.5;(2) soaking a circuit board of a PBC / Sn / NiCu structure in the deplating solution prepared in the step (1);(3) taking the circuit board in the step (2) out and ultrasonically cleaning the circuit boardwith water and drying the same; (4) soaking the surface of the circuit board in the step (3) in a formic acid aqueous solution; and (5) taking the surface of the circuit board in the step (3) out, and ultrasonically cleaning the circuit board with water and drying the same. A metal tin layer is unlikely to be corroded in the deplating process, no harmful gas is generated, and the environmental pollution is reduced; the cost is lowered, the process is simple, and actual production is facilitated; and the chemical deplating composition is clear to deplate and good in effect.

Description

technical field [0001] The invention relates to a deplating composition and a deplating method thereof, in particular to a chemical deplating composition for a nickel-copper alloy layer for a circuit board with a PBC / Sn / NiCu structure and a deplating method thereof. Background technique [0002] Electroless metal plating is widely used for its excellent wear resistance, corrosion resistance, weldability and outstanding electromagnetic shielding properties, especially the uniform thickness of the coating and good profiling, which is especially suitable for workpieces with complex shapes. Although the PCB process adopts advanced technology and strictly controls the process operation, defective products will also appear due to various reasons, such as surface oxidation, penetration plating, etc. If they are directly scrapped, the cost will be high; Strong corrosion resistance, while the difficulty is great. Although general PCB manufacturers have developed some methods of degr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/34
CPCC23F1/34
Inventor 欧志清
Owner 深圳市天熙科技开发有限公司
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