Pattern forming device using photo sintering and pattern forming method using same

Abstract

Provided are a pattern forming device using photo sintering and a pattern forming method using the same, the device comprising a supply roll, an application device, a mask, a light generating device,and a collection roll. The supply roll supplies a flexible substrate. The application device applies conductive ink onto the substrate. The mask is positioned at an upper part of the substrate to which the conductive ink is applied such that a pattern is formed thereon. The light generating device emits light at the conductive ink applied to the substrate at an upper part of the mask so as to forma conductive pattern on the substrate. The collection roll collects the substrate having the conductive pattern formed thereon.

Description

technical field [0001] The present invention relates to a pattern forming device using intense pulsed light sintering and a method of pattern forming using the pattern forming device, in particular, the present invention relates to a pattern forming device formed on a flexible substrate by intense pulsed light sintering Pattern coated with ink, and a method of pattern formation using the pattern forming device. Background technique [0002] Traditionally, in printed electronics, conductive inks are often used, in which metal powders such as gold, silver and copper are mixed with a solution. Metals are highly conductive and mechanically flexible to facilitate their use on flexible substrates. [0003] During patterning using conductive ink, thermal sintering is generally used, and during thermal sintering, the conductive ink is heated and cooled at a temperature between about 200°C and about 300°C to sinter the metal powder. [0004] However, thermal sintering is a relative...

AI Technical Summary

Problems solved by technology

This process is difficult to apply to substrates with relatively large dimensions, and the productivity or process efficiency is relatively poor

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