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Photosensitive composition and use thereof

A photosensitive composition and compound technology, applied in optics, filters, optical elements, etc., can solve the problems of difficulty in producing high-quality display elements, unsatisfactory and other problems, and achieve improved display quality and reliability, The effect of high practicality

Inactive Publication Date: 2018-07-31
JNC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Especially when these photosensitive compositions are used as color filter protective films, if these highly polar organic solvents are contained, they will permeate into the color filter layer of the base, such as pigments or dyes contained in pixels. It is difficult to produce high-quality display elements due to the dissolution of coloring materials
[0009] There is Patent Document 4 in which a photosensitive composition is used in a protective film of a color filter. As a result of confirming the properties, the solvent resistance is not satisfactory, and further improvement is desired

Method used

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  • Photosensitive composition and use thereof
  • Photosensitive composition and use thereof
  • Photosensitive composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0174] Next, the present invention will be specifically described with reference to synthesis examples, reference examples, examples, and comparative examples, but the present invention is not limited by these examples. In addition, regarding the abbreviations of the additives in Tables 1 to 2, M-520 is Aronix M-520 (trade name; Toagosei Co., Ltd.), a compound having a polymerizable double bond, and NCI-930 is light Polymerization initiator Adeka ARKLS (ADEKA ARKLS) NCI-930 (trade name; Adeka (ADEKA) Co., Ltd.), VG3101L is epoxy compound Tecmo (TECHMORE) VG3101L (trade name; Printek (Printec) Co., Ltd.), EHPE3150 is an epoxy compound EHPE3150 (trade name; Daicel (Daicel) Co., Ltd.), TMA is an epoxy hardener trimellitic anhydride, and S510 is a coupling agent Sarah Ace (Sila -Ace) S510 (trade name; Jieen Zhi (JNC) Co., Ltd.), AO-60 is antioxidant Aidi Costapor (ADK STAB) AO-60 (trade name; Adeka (ADEKA) Co., Ltd.) , F-556 is the surfactant Megafac (Megafac) F-556 (trade name; ...

Synthetic example 1

[0177] [Synthesis Example 1] Synthesis of Polyester Amic Acid (A) Solution

[0178] In a four-necked flask equipped with a stirrer, dehydrated and purified PGMEA, diethylene glycol ethyl methyl ether (hereinafter abbreviated as "EDM"), 4,4'-diphenyl Ether tetracarboxylic dianhydride (hereinafter abbreviated as "ODPA"), SMA1000P, 1,4-butanediol, and benzyl alcohol were stirred at 120° C. for 3 hours under a dry nitrogen stream.

[0179]

[0180] Thereafter, the reaction solution was cooled to 25°C, and 3,3'-diaminodiphenylsulfone (hereinafter abbreviated as "DDS") and EDM were added in the following weight, and stirred at 20°C to 30°C for 2 hours , and stirred at 120° C. for 2 hours.

[0181] DDS 12.72g

[0182] EDM 29.68g

[0183] [Z / Y=2.0, (Y+Z) / X=1.0]

[0184] The solution was cooled to room temperature to obtain a 30% by weight solution of a pale yellow transparent polyester amic acid (A). A part of the solution was sampled and the weight average molecular weight wa...

Synthetic example 2

[0185] [Synthesis Example 2] Synthesis of Epoxy Group-Containing Copolymer (B-1) Solution

[0186] In a four-necked flask with a stirrer, dehydrated and purified MMP as a polymerization solvent, glycidyl methacrylate as a radical polymerizable compound (a1) having an epoxy group, and Diethylene glycol dimethacrylate (NK ester 2G; trade name; Shin-Nakamura Chemical Industry Co., Ltd.) of other polymerizable compounds (a2), and then loaded with the following weight as the polymerization initiator Dimethyl-2 , 2′-azobis(2-methylpropionate) (V-601; trade name; Wako Pure Chemical Industries, Ltd.), and stirred at 110° C. for 2 hours under a stream of dry nitrogen.

[0187]

[0188] The solution was cooled to room temperature to obtain a 30.0% by weight solution of an epoxy group-containing copolymer (B-1). A part of the solution was sampled and the weight average molecular weight was determined by GPC analysis (polystyrene standard). As a result, the weight average molecular w...

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PUM

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Abstract

The invention relates to a photosensitive composition comprising the polyesteramide acid, a compound having the polymeric double bond, a photopolymerization initiator, an epoxy compound, and an epoxyhardener. The polyesteramide acid is obtained by reacting tetracarboxylic acid dianhydride, diamine, and polyhydroxy compound as the essentiality raw material component. A hardened film in which the transparency, the heat resistance, the resistance to solvents, the flatness and resolving potency are especially excellent can be obtained with the photosensitive composition of the invention. The hardened film is used for the electronic component etc.

Description

technical field [0001] The present invention relates to an insulating material for forming an electronic component, a passivation film, a buffer coating film, an interlayer insulating film, or a planarizing film in a semiconductor device, or an interlayer insulating film or a color filter in a display element. Photosensitive composition for protective film for sheet, etc. Furthermore, it is related with the electronic component containing the transparent film formed using the said photosensitive composition, and this film. Background technique [0002] In the manufacturing process of elements such as display elements, various chemical treatments such as organic solvents, acids, and alkali solutions are performed, or the surface is locally heated to a high temperature when forming a film of wiring electrodes by sputtering. Therefore, a surface protective film may be provided in order to prevent deterioration, damage, and deterioration of the surface of various elements. The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L35/02C08L79/08C08K5/092C08K5/5435C08F220/32C08F222/10C08G73/16G03F7/00G02B1/14
CPCC08F220/32C08G73/16C08L35/02C08L2201/08C08L2201/10C08F220/325G03F7/0007G02B1/14C08L79/08C08K5/092C08K5/5435C08F222/102G02B5/20G02F1/133514G03F7/004G03F7/027G03F7/028
Inventor 尾崎刚史
Owner JNC CORP
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