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A combined columnar chip enhanced boiling heat transfer microstructure and its manufacturing method

A boiling-enhancing, combined technology, used in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., to improve nucleate boiling heat transfer performance and critical heat flux density, increase critical heat flux density, and greatly attract force effect

Active Publication Date: 2019-08-23
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Aiming at the deficiencies and defects of the existing enhanced surface structure for cooling ultra-high heat flux electronic devices, the invention provides a combined columnar chip enhanced boiling heat transfer microstructure and its manufacturing method

Method used

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  • A combined columnar chip enhanced boiling heat transfer microstructure and its manufacturing method
  • A combined columnar chip enhanced boiling heat transfer microstructure and its manufacturing method
  • A combined columnar chip enhanced boiling heat transfer microstructure and its manufacturing method

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Embodiment Construction

[0028] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0029] see Figure 1 to Figure 3 , the purpose of the present invention is to utilize simultaneously "increasing the number of vaporization cores, enhancing capillary force, reducing flow resistance, separating the path of bubble separation and liquid replenishment" to provide a heat transfer device with high heat transfer efficiency and increased capillary pressure head. The function is to reduce the flow resistance and increase the critical heat flux. The chip enhanced boiling heat transfer structure of the micro-column variable curvature surface includes the heat dissipation plate 1 on the surface of the chip and several combined units formed on the heat dissipation plate 1 by dry etching technology. , the combined units are distributed in an array, each combined unit is composed of five micro-columns, the center of each combined unit is a cylindrical micro-column ...

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Abstract

The invention discloses a combined cylindrical chip reinforced boiling heat transfer microstructure and a manufacturing method thereof. The microstructure comprises a heat-dissipation plate arranged on the surface of a chip. The heat-dissipation plate is provided with a plurality of combination units. Each combination unit is formed by five microcolumns. The center of each combination unit is a cylindrical micro-column, and the rest four H-shaped micro-columns are arranged around the cylindrical micro-column symmetrically. The two surfaces of each H-shaped micro-column facing to the cylindrical micro-column and opposite to the cylindrical micro-column are the same parabolic surfaces, and the rest two sides surfaces and the top surface are planes; and every two adjacent combination units share one H-shaped micro-column. The microstructure can greatly increase the number of bubble evaporation cores, and greatly improve nucleate boiling heat transfer performance and critical heat flux density.

Description

technical field [0001] The invention belongs to ultra-high heat flux boiling enhanced heat transfer technology, and relates to a high-efficiency cooling technology suitable for ultra-high heat flux microelectronic chips, in particular to a combined columnar chip enhanced boiling heat transfer microstructure and a manufacturing method thereof. Background technique [0002] With the rapid development of MEMS microelectronic machining technology, the size of electronic components is constantly decreasing, and the operating frequency is getting higher and higher. It is the key to restricting the further improvement of the integration of electronic devices. Therefore, effectively solving the heat dissipation problem of electronic devices has become a key technology in the manufacture of electronic devices. [0003] At present, the use of liquids to cool electronic chips has attracted widespread attention from many scholars at home and abroad, especially the electronic chips are ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427H01L21/48
CPCH01L21/4803H01L23/427
Inventor 张永海刘斌魏进家周杰
Owner XI AN JIAOTONG UNIV
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