High-density integration device and method for multi-source sensor

Abstract

The invention discloses a high-density integration device for a multi-source sensor. The device is composed of six horizontal layers and two vertical function realization layers; the six horizontal layers comprise a polarization navigation realization layer, an X-direction inertia navigation layer, a multi-source navigation fusion processing layer, an energy supply layer, a signal processing layerand an image navigation and timing layer from top to bottom in sequence; the two vertical function realization layers are vertically arranged on two sides of the six horizontal layers; and the two vertical function realization layers comprise a Y-direction inertia navigation layer and an X-direction inertia navigation layer respectively. The device has the beneficial effects that a multifunctional substrate hybrid integrated framework based on a silicon substrate adapter plate is adopted, electrical signal interconnection among substrates is realized by adopting TSV silicon through holes, RDLre-wiring and metal ball bonding technology, and high-density 2.5-dimensional stacking and integration of a navigation sensing system chip-level module based on different principles is facilitated, so that the volume and weight of a micro system are greatly reduced, the utilization rate of the system space is improved, and the integration level is improved.

Description

technical field [0001] The invention relates to the field of heterogeneous integrated manufacturing of microsystems, in particular to a high-density integrated device and method for multi-source sensors. Background technique [0002] The navigation system is a necessary means for mobile platforms such as vehicles, aircrafts, and ships to obtain real-time position and direction and complete the scheduled tasks on time. Based on different principles, various navigation methods such as satellite, inertial, geomagnetic, astronomical, and images have emerged. However, single-source navigation is often limited by specific environments or conditions, and it is difficult to meet the navigation requirements in long-term, unknown, and complex environments. [0003] Combined navigation, which organically combines two or more navigation methods, has gradually evolved into the main mode of modern navigation. The integrated navigation system can give full play to the advantages of each ...

AI Technical Summary

Problems solved by technology

[0005] The invention discloses a multi-source sensor high-density integration device and method to solve the problems of high-precision, low power consumption, small volume, and light weight navigation requirements of existing micro-miniature platforms. The invention proposes a silicon-based The multi-functional substrate hybrid integration architecture of the adapter board rationally layered and assembled polarized light sensors, image sensors, inertial sensors, chip atomic clocks and other sensing and timing functional units, as well as power circuits, multi-source navigation solution circuits, and passive devices. On the silicon-based adapter board, at the same time, through TSV-RDL and metal ball bonding technology, the electrical signal connection between different functional board levels is realized. Through the 2.5-dimensional high-density assembly technology, the three-dimensional high-precision assembly of multiple substrates is realized, and finally multi-substrates are realized. High Density System Heterogeneous Integration of Various Sensing Units

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