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Chemical nickel-plating-molybdenum-phosphorus alloy solution for preparing high molybdenum and high phosphorus coating

A technology of electroless nickel plating and alloy solution, applied in liquid electroless plating, coating, metal material coating process, etc., can solve the problem of not being able to prepare Mo and P content at the same time, achieve good diffusion barrier performance and improve reliability , the effect of high thermal stability

Inactive Publication Date: 2018-07-13
SHENYANG POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Purpose of the invention: the present invention discloses a plating solution formula for preparing an electroless nickel-molybdenum-phosphorus alloy solution for preparing high molybdenum and high phosphorus coatings, so as to solve the problem that the current electroless nickel-molybdenum-phosphorus plating solution cannot prepare Mo and P content at the same time The problem of higher plating

Method used

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  • Chemical nickel-plating-molybdenum-phosphorus alloy solution for preparing high molybdenum and high phosphorus coating
  • Chemical nickel-plating-molybdenum-phosphorus alloy solution for preparing high molybdenum and high phosphorus coating
  • Chemical nickel-plating-molybdenum-phosphorus alloy solution for preparing high molybdenum and high phosphorus coating

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Nickel sulfate: 26 g / L

[0062] Sodium hypophosphite: 27 g / l

[0063] Sodium molybdate: 0.6 g / L

[0064] Sodium citrate: 40 g / l

[0065] Propionic acid: 1ml / L

[0066] Sodium tetraborate: 10 g / L

[0067] Sodium acetate: 10 g / L

[0068] Saccharin: 0.8 g / L

[0069] pH: 8.5 (adjust pH with ammonia water)

[0070] Temperature: 80°C

[0071] Add water to volume

Embodiment 2

[0073] Nickel sulfate: 36 g / L

[0074] Sodium hypophosphite: 37 g / l

[0075] Sodium molybdate: 0.7 g / L

[0076] Sodium citrate: 50 g / l

[0077] Propionic acid: 2.5 ml / l

[0078] Sodium tetraborate: 15 g / L

[0079] Sodium acetate: 20 g / l

[0080] Saccharin: 0.9 g / l

[0081] pH: 8.5 (adjust pH with ammonia water)

[0082] Temperature: 80°C

[0083] Add water to volume

Embodiment 3

[0085] Nickel sulfate: 30 g / L

[0086] Sodium hypophosphite: 32 g / L

[0087] Sodium molybdate: 0.66 g / L

[0088] Sodium citrate: 45 g / l

[0089] Propionic acid: 2ml / L

[0090] Sodium tetraborate: 12 g / l

[0091] Sodium acetate: 15 g / l

[0092] Saccharin: 0.84 g / L

[0093] pH: 8.3 (adjust pH with ammonia water)

[0094] Temperature: 76°C

[0095] Add water to volume

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Abstract

The invention discloses a chemical nickel-plating-molybdenum-phosphorus alloy solution for preparing a high molybdenum and high phosphorus coating. The problem that an existing chemical nickel-plating-molybdenum-phosphorus alloy solution cannot simultaneously prepare a coating with high Mo and P contents is solved. The chemical nickel-plating-molybdenum-phosphorus alloy solution comprises nickel sulfate, sodium hypophosphite, sodium molybdate, sodium citrate, propionic acid, sodium tetraborate, sodium acetate and saccharin; and the PH is 8.0-8.5, and the plating solution temperature is 75-80 DEG C. The deposition rate of the coating is required to be controlled at 5-8 microns per hour. The results of scanning electron microscopy showed that the contents of molybdenum and phosphorus are higher in the coating prepared by the chemical nickel-plating-molybdenum-phosphorus alloy solution. The chemical nickel-plating-molybdenum-phosphorus alloy solution can be widely used in the field whichboth the thermal stability and amorphous structures are required and a chemical nickel-plating-molybdenum-phosphorus coating is used as a diffusion impervious layer in electron industries.

Description

technical field [0001] The invention relates to nickel-molybdenum-phosphorus ternary alloy electroless plating in the field of material surface treatment, especially in the field of the electronic industry that requires both thermal stability and amorphous structure as a diffusion barrier layer. Background technique [0002] The ternary alloy nickel-molybdenum-phosphorus coating is more excellent than the binary alloy nickel-phosphorus coating. At present, in the field of copper interconnection of integrated circuits, nickel-molybdenum-phosphorus coating can be used as a diffusion barrier layer in the field of copper interconnection of integrated circuits to prevent copper Diffusion into silicon dioxide is very important to improve the reliability of silicon-based integrated circuits. [0003] The electroless plating ternary alloy nickel-molybdenum-phosphorus process is developed on the basis of the electroless plating binary alloy nickel-phosphorus. The introduction of met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/50
CPCC23C18/50
Inventor 孙硕孔淼刘滢蔡新雯张加帅严鸣马正华
Owner SHENYANG POLYTECHNIC UNIV
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