Chip packaging substrate and chip packaging structure
A chip packaging structure and chip packaging technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve problems such as electrical short circuits, and achieve the effect of avoiding electrical short circuits, good quality and reliability
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[0047] figure 1 It is a schematic partial top view of a chip package substrate according to an embodiment of the present invention. figure 2 yes figure 1 A partial bottom view of the chip package substrate. image 3 yes figure 1 The schematic cross-sectional view of the chip packaging substrate along the line segment A-A, where image 3 Some pins are omitted from the illustration. Please refer to Figure 1 to Figure 3 , in this embodiment, the chip package substrate 100 includes a flexible film 110, a plurality of pins 120, a conductive layer 130, a plurality of first lines 140, a plurality of conductive members 150, and a plurality of second lines 160, wherein The material of the flexible film 110 can be polyimide (PI) or polyester resin (PET), and has a first surface 111 and a second surface 112 opposite to each other, a plurality of packaging areas 113 and the The transmission areas 114 and 115 on opposite sides. The pins 120 are disposed on the first surface 111 an...
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