Humic acid modified reinforced phenolic foam material
A phenolic foam material and humic acid technology, applied in the field of material science, can solve the problems of poor mechanical strength, high brittleness of phenolic foam, easy slag drop, etc., and achieve the effect of high toughness
Inactive Publication Date: 2018-06-29
罗嘉辉
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Problems solved by technology
[0003] However, the brittleness of phenolic foam is large, and it is easy to drop slag, resulting in poor mechanical strength. In order to further improve the heat resistance of phenolic foam, it is necessary to modify the phenolic resin to prepare phenolic foam with excellent mechanical properties and heat resistance.
At present, there is no relevant report on the application of humic acid in the modification of phenolic foam materials
Method used
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Embodiment
[0015] A kind of humic acid modified reinforced phenolic foam material of the present invention, its raw material and raw material weight percent are as follows: expandable phenolic resin 45%, ethyl methacrylate 0.5%, propylene oxide 0.5%, kaolin 1 %, dispersant 2%, halloysite nanotube 51%.
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Abstract
The invention provides a humic acid modified reinforced phenolic foam material, which includes, by weight, 40-50% of volatile phenolic resin, 0.1-1% of ethyl methacrylate, 0.1-3% of epoxy propane, 0.1-3% of kaolin, 0.1-3% of a dispersant, and 40-60% of halloysite nanotubes. The phenolic foam material has high toughness, is heat-resistant and is free of scaling.
Description
technical field [0001] The invention belongs to the technical field of material science, and in particular relates to a humic acid modified reinforced phenolic foam material. Background technique [0002] Phenolic foam is prepared by adding foaming agent, curing agent and other modifying reagents to the liquid thermal solid phase phenolic resin obtained by polycondensation of formaldehyde and phenol under alkali-catalyzed conditions, and foaming by controlling the reaction temperature. In the application field of building exterior wall insulation materials, phenolic foam has excellent combustion resistance, high temperature resistance and thermal insulation properties, and has become a research hotspot and the preferred material for use. [0003] However, the brittleness of phenolic foam is large, and it is easy to drop slag, resulting in poor mechanical strength. In order to further improve the heat resistance of phenolic foam, it is necessary to modify the phenolic resin t...
Claims
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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/14C08L61/06C08L51/08C08K7/24C08K3/34C08J9/00
CPCC08J9/0071C08J9/0066C08J2351/08C08J2361/06C08J2361/14C08K3/346C08K7/24C08K2201/011
Inventor 罗嘉辉
Owner 罗嘉辉
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