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Polyimide composition, polyimide film and circuit board

A technology of polyimide film and polyimide, which is applied in the direction of printed circuit, printed circuit, printed circuit parts, etc., and can solve the problems of poor alkali resistance and other problems

Active Publication Date: 2020-06-09
ZHEN DING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the photosensitive polyimide composition with -COOH functional group currently used in the industry has poor alkali resistance.

Method used

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  • Polyimide composition, polyimide film and circuit board
  • Polyimide composition, polyimide film and circuit board
  • Polyimide composition, polyimide film and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] In the present embodiment, the structural formula of the PI-COOH used is

[0048]

[0049] The polyimide composition of this embodiment consists of the above-mentioned PI-COOH, aliphatic polyurethane triacrylate, 2-acrylic acid-2-[[(butylamino)-carbonyl] oxo] ethyl ester, 4,6-di It is prepared from (octylthiomethyl) o-cresol and 1-hydroxycyclohexyl phenyl ketone. Wherein the massfraction of PI-COOH is 59%, the massfraction of aliphatic polyurethane triacrylate is 19%, the massfraction of 2-acrylic acid-2-[[(butylamino)-carbonyl] oxo] ethyl ester is 19% %, the mass fraction of 4,6-bis(octylthiomethyl)-o-cresol is 1%, and the mass fraction of 1-hydroxycyclohexyl phenyl ketone is 2%.

Embodiment 2

[0051] In the present embodiment, the structural formula of the PI-COOH used is

[0052]

[0053] The polyimide composition of this embodiment consists of the above-mentioned PI-COOH, aliphatic polyurethane triacrylate, 2-acrylic acid-2-[[(butylamino)-carbonyl] oxo] ethyl ester, 4,6-di It is prepared from (octylthiomethyl) o-cresol and 1-hydroxycyclohexyl phenyl ketone. Wherein the massfraction of PI-COOH is 58%, the massfraction of aliphatic polyurethane triacrylate is 19%, the massfraction of 2-acrylic acid-2-[[(butylamino)-carbonyl] oxo] ethyl ester is 19% %, the mass fraction of 4,6-bis(octylthiomethyl)-o-cresol is 2%, and the mass fraction of 1-hydroxycyclohexyl phenyl ketone is 2%.

Embodiment 3

[0055] In the present embodiment, the structural formula of the PI-COOH used is

[0056]

[0057] The polyimide composition of this embodiment consists of the above-mentioned PI-COOH, aliphatic polyurethane triacrylate, 2-acrylic acid-2-[[(butylamino)-carbonyl] oxo] ethyl ester, 4,6-di It is prepared from (octylthiomethyl) o-cresol and 1-hydroxycyclohexyl phenyl ketone. Wherein the massfraction of PI-COOH is 57%, the massfraction of aliphatic polyurethane triacrylate is 19%, the massfraction of 2-acrylic acid-2-[[(butylamino)-carbonyl] oxo] ethyl ester is 19% %, the mass fraction of 4,6-bis(octylthiomethyl)-o-cresol is 3%, and the mass fraction of 1-hydroxycyclohexyl phenyl ketone is 2%.

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Abstract

The invention discloses a polyimide composition comprising polyimide and a high polymer; the high polymer is formed by carrying out a photosensitive polymerization reaction on a photosensitive polymer, a photosensitive monomer and a photoinitiator; the polyimide composition further comprises a sulfur-containing compound selected from one or more of 4,6-bis(octylthiomethyl)-o-cresol, 2,4-bis(dodecylthiomethyl)-6-methylphenol and 4-[(4,6-bis(octylthio-1,3,5-triazin-2-yl)amino]-2,6-di-tert-butylphenol; and polyimide contains -COOH. The sulfur-containing compound is added in the polyimide composition and is subjected to a thermal crosslinking reaction with polyimide containing -COOH when a circuit board covering film is produced, so that the alkali resistance of the covering film is effectively improved. In addition, the invention provides a polyimide film prepared from the polyimide composition and a circuit board produced by applying the polyimide film.

Description

technical field [0001] The invention relates to a polyimide composition, a polyimide film and a circuit board prepared from the polyimide composition. Background technique [0002] In recent years, flexible circuit boards have become more and more widely used in electronic products. In the production process of flexible circuit boards, after etching and forming lines on the substrate, a layer of polyimide film must be attached to the lines to block moisture and prevent metal lines from being oxidized and corroded. The polyimide film can also protect the circuit from being damaged by high temperature during assembly, enhance the insulation resistance between the circuits, and space out the area where the flexible circuit board needs to be assembled and soldered. [0003] The commonly used photosensitive polyimide film has the advantages of flex resistance, heat resistance and high alignment accuracy. However, the photosensitive polyimide composition with -COOH functional gr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08L75/14C08K5/375C08J5/18H05K1/02
CPCC08J5/18C08J2379/08C08J2475/14C08L79/08C08L2203/16H05K1/02H05K2201/0154C08L75/14C08K5/372
Inventor 徐茂峰黄黎明
Owner ZHEN DING TECH CO LTD
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