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Dicing sheet and method for producing dicing sheet

A technology for cutting slices and thin films, which is applied in chemical instruments and methods, thin film/sheet adhesives, semiconductor/solid device manufacturing, etc., and can solve the problems of increased production of filamentous cutting slices, etc.

Active Publication Date: 2018-06-08
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, since the amount of substrate film cut off during dicing is larger than that of semiconductor wafers, there is a tendency for the generation of filamentous chips to increase.

Method used

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  • Dicing sheet and method for producing dicing sheet
  • Dicing sheet and method for producing dicing sheet
  • Dicing sheet and method for producing dicing sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0099] 1. Fabrication of Substrate Film

[0100] An ethylene-based copolymer comprising ethylene and a radically polymerizable acid anhydride as constituent units, a polyol compound having two or more hydroxyl groups, and a reaction accelerator that promotes a temperature-dependent dynamic covalent bond bonding reaction and dissociation reaction The thermoplastic resin is a thermoplastic resin (manufactured by Japan Polyethylene Corporation, product Name "Rexpearl ES323Y", temperature 190 ℃ and melt flow rate when load 2.16kg: 4g / 10 minutes) with small T-die extruder (TOYO Seiki Seisaku-Sho., Ltd., product name "Labo Plasto Mill ”) extrusion molding to obtain a substrate film formed of a resin layer with a thickness of 80 μm.

[0101] 2. Preparation of Adhesive Composition

[0102] 100 parts by mass of copolymer (Mw: 500,000) formed by copolymerizing 95 parts by mass of n-butyl acrylate and 5 parts by mass of acrylic acid, 120 parts by mass of urethane acrylate oligomer (Mw:...

Embodiment 2

[0106] An ethylene-based copolymer comprising ethylene and a radically polymerizable acid anhydride as constituent units, a polyol compound having two or more hydroxyl groups, and a reaction accelerator that promotes a temperature-dependent dynamic covalent bond bonding reaction and dissociation reaction Thermoplastic resins other than thermoplastic resins (manufactured by Japan Polyethylene Corporation) in which carboxyl groups derived from the above-mentioned radically polymerizable anhydrides of the above-mentioned ethylene-based copolymers and hydroxyl groups of the above-mentioned polyol compounds form ester bonds in the presence of the above-mentioned reaction accelerators are used. , product name "Rexpearl ES333Y", melt flow rate at a temperature of 190° C. and a load of 2.16 kg: 6 g / 10 minutes), a cut sheet was obtained in the same manner as in Example 1.

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Abstract

The invention provides a dicing sheet and a method for producing the dicing sheet. The dicing sheet 1 which is provided with a base film 2 and an adhesive layer 3 that is laminated on one surface of the base film 2. The base film 2 is provided with at least a resin layer 21 that is positioned closest to the adhesive layer 3; the melting point of a resin which constitutes the resin layer 21 is from60 DEG C to 170 DEG C (inclusive); and the difference between the melting point and the fluidization temperature of the resin is from 40 DEG C to 190 DEG C (inclusive). This dicing sheet 1 is able tobe produced without requiring irradiation of radiation and is able to be suppressed in the formation of thread-like cut pieces, while exhibiting good expandability.

Description

technical field [0001] The present invention relates to a dicing sheet to which the dicing object is pasted when the dicing object such as a semiconductor wafer is cut and separated into element blocks, and a method for manufacturing the dicing sheet. Background technique [0002] Semiconductor wafers such as silicone and gallium arsenide, substrates such as glass substrates and alumina substrates, and various packages (collectively referred to as "cut objects" in this manual) are manufactured in a large-diameter state, and they are After being cut and separated (diced) into element blocks (referred to as "chips" in the patent specification of the present invention), and individually peeled off (picked up, pick up), they are transported to the mounting process which is the next process. At this time, the cut-out objects such as semiconductor wafers are transferred to the steps of dicing, cleaning, drying, expanding, picking up, and mounting in the state of being attached to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/301C09J7/24C09J7/29C09J7/20
CPCC09J7/20C09J7/243C09J7/29B32B27/08B32B27/32C09J2203/326
Inventor 河原田有纪田矢直纪
Owner LINTEC CORP
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