A kind of fpc circuit figure making method

Abstract

The invention provides an FPC circuit pattern making method, and the method comprises the steps: employing UV light curing ink for replacing a conventional dry film and other photoresists, carrying out the UV light curing of an FPC sheet material after ink printing, enabling a UV light curing ink to be hardened but not completely solidified, and forming a protection film layer with a pattern; enabling the protection film layer to be hardened but not transferred (not to be solidified on an FPC), forming a temporary anti-corrosion protection film layer, thereby enabling the protection film layerto be easily peeled off after etching, reducing the steps of dry film pasting, silent standing and hardening and development, enabling the efficiency to be high, enabling the flow to be simple, saving the manufacturing cost of equipment and development auxiliary materials, and reducing the cost. The FPC can be directly transferred out of a yellow region for operation after the UV light curing, sothe time is short and the impact on employees is small.

Description

technical field [0001] The invention relates to the field of FPC, in particular to an FPC circuit pattern manufacturing method with high production efficiency and low cost. Background technique [0002] FPC (Flexible Printed Circuit, flexible circuit board), also known as soft board, is a highly reliable and flexible printed circuit board made of polyimide or polyester film as the base material. , an indispensable and important connector for automobiles and consumer electronics. [0003] The FPC circuit production method often adopts the printed circuit board halving photosensitive pattern production process method, that is, laying a photosensitive resist such as a dry film on the surface of the FPC, then exposing the dry film and developing it into an image, and then etching it out. Lines, and finally the process of stripping the resist. The specific steps are: 1. Paste dry film and other photosensitive resists on the FPC, and then let it stand for 5-10 minutes after comp...

AI Technical Summary

Problems solved by technology

Among the above process steps, steps 1 to 3 need to be completed under the condition of yellow light, which has the following disadvantages: 1) The production cycle is long, the process is cumbersome, and the efficiency is low; 2) Employees operate in the yellow light source for a long time, and it is easy to be unsuitable ; 3) The film thickness of the dry film waiting for the line protection film to be transferred is thick, and the side etching rate is high; 4) The cost of auxiliary materials is high, and auxiliary materials such as dry film and developer are needed, and the cost is relatively high

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