Large-area super-resolution photoetching device

Abstract

The invention discloses a large-area super-resolution photoetching device and belongs to the technical field of super-resolution photoetching equipment. The device comprises a vibration isolation foundation, an active vibration isolation platform, a main base plate, an ultraviolet exposure light source, a gap detection system, an alignment module, a super-resolution photoetching lens module, a workbench module, a laser interferometry system, an ultraprecise environmental control system and a control system. Through an interference technology, the device achieves online gap detection of nanometer level precision; through a precise levelling and gap control technology, the gap photoetching function at tens of nanometer levels is achieved; through a local air control technology of a sheet bearing platform, the large-area super-resolution stepping photoetching function is achieved.

Description

Technical field [0001] The invention belongs to the technical field of lithography equipment, and specifically relates to a large-area super-resolution lithography device. Background technique [0002] The current technologies used for micro-nano structure pattern processing mainly include: proximity lithography, projection lithography, nanoimprint technology and electron beam direct writing technology. [0003] Contact lithography technology is a traditional optical lithography method, in which a pre-made mask is directly exposed to a silicon wafer coated with photoresist. Contact lithography technology has the advantages of high resolution, simple equipment, convenient operation and low cost; but its fatal disadvantage is that the mask and photoresist are in direct contact, which is easy to damage and contaminate the mask, so the service life of the mask Short, multiple use will seriously affect the yield of the chip. Proximity lithography is to avoid defects caused by contact ...

AI Technical Summary

Problems solved by technology

Off-axis SP excitation illumination has increased the working distance of lithography to the order of hundreds of nanometers, but how to accurately detect and control the gap to ensure the stability and reliability of lithography has become a new technical problem

Capacitive sensors are the most commonly used gap detection detectors. Usually, electrodes are embedded in the mask and the surface of the substrate to form parallel plate capacitance. Although the structure is simple and easy to implement, the mask substrate is limited and will be affected during the exposure process. Drift effect is also obvious

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