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Measuring system and measuring method considering focusing and leveling and precision alignment

A measurement system, focusing and leveling technology, applied in the field of lithography machines, can solve the problems of long production time, high space occupancy rate of lithography machines, and low yield of lithography machines

Active Publication Date: 2020-07-07
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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  • Abstract
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a measurement system and measurement method that takes into account both focus adjustment, leveling and precision alignment, so as to solve the problems caused by the independent vertical and horizontal detection systems in the existing photolithography machines. For the problem of high space occupancy of lithography machines, the present invention also provides a measurement method to solve the problems caused by the prior vertical measurement of the existing lithography machines, focusing and leveling the workpieces to be measured, and then aligning the workpieces. The problem of long production time and low yield of lithography machine

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  • Measuring system and measuring method considering focusing and leveling and precision alignment
  • Measuring system and measuring method considering focusing and leveling and precision alignment

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Embodiment Construction

[0024] In order to make the purpose, technical solution and advantages of the device of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0025] refer to figure 1 , the measurement system includes a six-degree-of-freedom nano-motion stage 1; a film-supporting stage 2, which is installed on the six-degree-of-freedom nano-motion stage 1; a silicon wafer 3 to be exposed; an exposure mask 4, which is fixed by a mask holding device 6; Substrate 5; mask holding device 6, fixed on the main substrate 5; alignment mark 7 on the substrate; gap measurement mark 8 on the mask; alignment mark area 9 on the mask; illumination source lens 10; 1. The second X\Y axis displacement table 100\200; the first and second Tz axis rotation table 101\201 are respectively installed on the first and second X\Y axis displacement table 100\200; the first and the second Two inclined adapter plates 102\202 are resp...

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Abstract

The invention discloses a measuring system considering focusing and leveling and precision alignment and a measuring method thereof. The system is characterized in that a dark field moire fringe alignment deviation detection function and a chirped grating gap detection function are integrated into one group of detection units. According to the measurement system considering alignment and focusingleveling, an integrated structure of a vertical measurement system and a horizontal measurement system is realized, the space requirement of a photoetching machine complete machine system is reduced,and the space occupation rate of a photoetching machine is reduced. According to the measuring method of the measuring system considering alignment and focusing leveling, the focusing leveling and alignment of the substrate are achieved, and the working efficiency of a photoetching machine is improved.

Description

technical field [0001] The invention relates to the field of lithography machines, in particular to a measurement system and a measurement method thereof that take into account both focusing, leveling, and precision alignment, and a lithography machine based on the measurement system and the measurement method thereof. Background technique [0002] In the production process of semiconductor chips, in order to achieve the desired accuracy index, it is necessary to accurately establish the relationship between the various coordinate systems of the lithography machine, so that the mask, objective lens, and wafer stage can establish a unified positional relationship. Usually, these devices are equipped with one or more sets of vertical detection systems, which are used to adjust the focus and level the substrate under test before aligning the mask with the substrate. On the one hand, to ensure that the substrate is in the imaging of the mask On the other hand, when the substrate...

Claims

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Application Information

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IPC IPC(8): G03F9/00
CPCG03F9/7023G03F9/7088
Inventor 罗先刚刘明刚高平蒲明博马晓亮李雄
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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