A heat dissipation structure that solves the problem of blocking the heat conduction channel of the heating element
A heating element and heat conduction technology, applied in the field of inertial navigation systems, can solve the problems of heating element operating temperature rise, thermal resistance increase, device damage, etc., to reduce operating temperature, reduce machining costs, ensure accuracy and service life Effect
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[0021] The embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the embodiments are illustrative, not restrictive, and cannot limit the protection scope of the present invention.
[0022] A heat dissipation structure for solving the problem of blocking heat conduction channels of heating elements, comprising a heating element mounting substrate 1 , a heat conducting plate 2 , a heating element 3 and a radiator 4 . The heating element mounting substrate is a metal or non-metallic substrate, the heating element and the heat conducting plate are installed on the heating element mounting substrate, and the heat conducting plate is located outside the heating element. The thermal conductivity of the material of the heat conduction plate is required to be large, and the heat conduction plate itself has good thermal conductivity; the heat conduction plate is preferably an integral structure, and i...
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