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A heat dissipation structure that solves the problem of blocking the heat conduction channel of the heating element

A heating element and heat conduction technology, applied in the field of inertial navigation systems, can solve the problems of heating element operating temperature rise, thermal resistance increase, device damage, etc., to reduce operating temperature, reduce machining costs, ensure accuracy and service life Effect

Active Publication Date: 2019-11-26
TIANJIN NAVIGATION INSTR RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, since it is difficult to completely match the relative dimensions of the heating element, radiator, and heat conduction plate, there is usually a gap in this thermal path, which blocks the heat conduction channel, greatly increases the thermal resistance, and forms a thermal disconnection, resulting in a lower operating temperature of the heating element. Rise or even over temperature, device damage

Method used

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  • A heat dissipation structure that solves the problem of blocking the heat conduction channel of the heating element
  • A heat dissipation structure that solves the problem of blocking the heat conduction channel of the heating element
  • A heat dissipation structure that solves the problem of blocking the heat conduction channel of the heating element

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Embodiment Construction

[0021] The embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the embodiments are illustrative, not restrictive, and cannot limit the protection scope of the present invention.

[0022] A heat dissipation structure for solving the problem of blocking heat conduction channels of heating elements, comprising a heating element mounting substrate 1 , a heat conducting plate 2 , a heating element 3 and a radiator 4 . The heating element mounting substrate is a metal or non-metallic substrate, the heating element and the heat conducting plate are installed on the heating element mounting substrate, and the heat conducting plate is located outside the heating element. The thermal conductivity of the material of the heat conduction plate is required to be large, and the heat conduction plate itself has good thermal conductivity; the heat conduction plate is preferably an integral structure, and i...

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Abstract

The invention relates to a cooling structure scheme for solving a blocking problem of a heat conduction passage of a heat generation component. The scheme mainly involves a matching relation among a heat generation component installation substrate, a heat conduction plate, a heat generation component and a heat sink, wherein the heat sink is arranged above the heat generation component, an inner bottom surface of the heat sink is closely attached onto an upper surface (a heat generation surface) of the heat generation component, an inner side wall of the heat sink is closely fastened with an outer side wall of a vertical plate of the heat conduction plate, the height of a horizontal plate of the heat conduction plate is L1, the integral height of the heat conduction plate is L4, the heightof the heat generation component is L3, the height of the heat sink is L2, and the size requirement is as follows: L4<L3 and L3>L1+L2. The invention provides the cooling structure scheme capable of effectively solving the blocking problem of the heat conduction passage of the heat generation component; with the adoption of the cooling structure, heat of the heat generation component can be effectively and completely dissipated, and a working temperature of the heat generation component is enabled not to exceed a limit; and meanwhile, the working temperature in the system is reduced, a favorable working ambient temperature is provided for an internal device, the accuracy and the service lifetime of the device are ensured, so that the output accuracy and the reliability of the system are improved.

Description

technical field [0001] The invention belongs to the technical field of inertial navigation systems, and relates to how to establish an effective heat transfer path for heating elements in the inertial navigation system to reduce the internal space temperature of the system, and specifically relates to a heat dissipation structure solution to solve the problem of blocking heat conduction channels of heating elements. Background technique [0002] The internal space temperature of the inertial navigation system and the working temperature of the heating element have always been issues that need to be considered urgently and effectively dealt with in the system design process. If the heat of the heating element cannot be effectively exported, its own temperature will rise, and at the same time, the temperature of the internal space of the system will rise as a whole, causing the internal devices to work at high temperatures all the time, affecting the accuracy and service life o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20436
Inventor 杨盛林张宇李德春王晓丹吴国强
Owner TIANJIN NAVIGATION INSTR RES INST
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