Method for reducing overflow in injection molding of IPM (Intelligent Power Module) and DBC substrate

A technology of injection molding and substrates, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of reducing the cooling area of ​​the module, reducing the reliability of the module, affecting the appearance and quality of the module, and reducing production. Even input and force balance, and the effect of reducing the scrap rate

Pending Publication Date: 2018-05-01
XIAN YONGDIAN ELECTRIC
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Problems solved by technology

When each module is injected, the fixed positioning of the DBC is mainly achieved by the pressure exerted by the top of the upper mold on the two islands of the DBC. The pressure on the DBC is mainly concentrated at the far end of the PCB, so it often occurs that the DBC is close to the PCB. Flashing occurs, which not only affects the appearance quality of the module, but also greatly reduces the heat dissipation function of the module due to the reduction of the heat dissipation area, and reduces the reliability of the module
At present, the problem of flashing can only be improved by laser deburring process

Method used

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  • Method for reducing overflow in injection molding of IPM (Intelligent Power Module) and DBC substrate
  • Method for reducing overflow in injection molding of IPM (Intelligent Power Module) and DBC substrate
  • Method for reducing overflow in injection molding of IPM (Intelligent Power Module) and DBC substrate

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Embodiment Construction

[0022] The present invention is described in further detail below in conjunction with accompanying drawing:

[0023] see Figure 2-Figure 4 : The present invention reduces the method for injection molding overflow of IPM module, changes the island design on the DBC substrate 1, makes the DBC substrate 1 be stressed in the injection molding process; and designs a "wedge-shaped" table top on the DBC back copper layer 7 on the back of the DBC substrate 1 The structure 10 forms a buffer platform for the flow rate of the injection material on the back of the DBC substrate 1, and reduces the overflow of the injection material to the back of the DBC substrate 1 when the DBC substrate 1 is uneven. Specifically:

[0024] In the layout design of the DBC substrate 1 , four second islands 4 are added at the four corners of the DBC substrate 1 . The ejector pin of the upper mold is directly pressed on the second island 4 added at the four corners of the DBC substrate 1; the original firs...

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Abstract

The invention discloses a method for reducing overflow in injection molding of an IPM (Intelligent Power Module) and a DBC substrate. The method changes an island design on the DBC substrate and enables the DBC substrate to be balanced in stress in the injection molding process. In addition, a wedge-shaped table structure is designed on a DBC back copper layer at the back of the DBC substrate, a buffer table for the flow rate of an injection molding material at the back of the DBC substrate is formed, and the injection molding material overflowed towards the back of the DBC substrate is reduced under a condition that the DBC substrate is uneven. According to the invention, the method of reducing the overflow through changing the DBC design idea is adopted to replace a laser burr removing process, the production efficiency is improved, and the production cost and technological input are reduced.

Description

technical field [0001] The invention belongs to the technical field of IGBT chips and relates to injection molding of IPM modules, in particular to a method for reducing injection molding overflow of IPM modules and a DBC substrate. Background technique [0002] Intelligent power module IPM (Intelligent Power Module) is a new type of control module that integrates IGBT chip and its drive circuit, control circuit and overcurrent, undervoltage, short circuit, overheating and other protection circuits. It is a complex and advanced power module that can automatically realize complex protection functions such as overcurrent, undervoltage, short circuit and overheating, so it has intelligent features. At the same time, it has the advantages of low cost, miniaturization, high reliability, and easy use, and is widely used in frequency conversion household appliances, servo motors, industrial frequency conversion and other fields. [0003] The plastic-encapsulated IPM module will ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/492
CPCH01L21/4871H01L23/4922
Inventor 叶娜王豹子谢龙飞李萍
Owner XIAN YONGDIAN ELECTRIC
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